Integrated circuit package

Abstract

Description

FIG. 1 is a front elevational view of an integrated circuit package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right elevational view thereof, the left side being the same in appearance as the right side;

FIG. 5 is a top, front, right perspective view thereof; and,

FIG. 6 is a bottom, rear, right perspective view thereof.

Claims

The ornamental design for an integrated circuit package, as shown and described.