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The ornamental design for an integrated circuit package, as shown and described. |
FIG. 1 is a front elevational view of an integrated circuit package showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right elevational view thereof, the left side being the same in appearance as the right side;
FIG. 5 is a top, front, right perspective view thereof; and,
FIG. 6 is a bottom, rear, right perspective view thereof.
Kobayashi, Kazuhiro, Tanabe, Osamu, Shiraishi, Masayoshi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 02 1998 | Citizen Electronics Co., Ltd. | (assignment on the face of the patent) | / | |||
Sep 02 1998 | Seiko Instruments Inc. | (assignment on the face of the patent) | / | |||
Jul 14 1999 | KOBAYASHI, KAZUHIRO | CITIZEN ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Jul 14 1999 | SHIRAISHI, MASAYOSHI | CITIZEN ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Jul 14 1999 | TANABE, OSAMU | CITIZEN ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Jul 14 1999 | KOBAYASHI, KAZUHIRO | Seiko Instruments Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Jul 14 1999 | SHIRAISHI, MASAYOSHI | Seiko Instruments Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Jul 14 1999 | TANABE, OSAMU | Seiko Instruments Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010129 | /0305 | |
Oct 29 2013 | Seiko Instruments Inc | SII CRYSTAL TECHNOLOGY INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031710 | /0079 |
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