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The ornamental design for a “light-emitting diode,” as shown and described.
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FIG. 1 is a perspective view of a “light-emitting diode” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view showing the practical usage thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Wang, Bily, Chuang, Jonnie, Yen, Huang Hui
Patent | Priority | Assignee | Title |
10134961, | Mar 30 2012 | CREELED, INC | Submount based surface mount device (SMD) light emitter components and methods |
10222032, | Mar 30 2012 | CREELED, INC | Light emitter components and methods having improved electrical contacts |
10720412, | Feb 13 2015 | Nichia Corporation | Light emitting device |
11004890, | Mar 30 2012 | CREELED, INC | Substrate based light emitter devices, components, and related methods |
11508701, | Feb 13 2015 | Nichia Corporation | Light emitting device |
7714334, | Aug 16 2007 | Polarless surface mounting light emitting diode | |
9735198, | Mar 30 2012 | CREELED, INC | Substrate based light emitter devices, components, and related methods |
9780268, | Apr 04 2006 | CREELED, INC | Submount based surface mount device (SMD) light emitter components and methods |
D566059, | Jan 05 2007 | Rohm Co., Ltd. | Light emitting diode module |
D640644, | Mar 19 2010 | Everlight Electronics Co., Ltd. | Light emitting diode package |
D644190, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Light-emitting diode |
D644191, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode |
D649942, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Light-emitting diode |
D738832, | Apr 04 2006 | CREELED, INC | Light emitting diode (LED) package |
D770988, | Feb 06 2015 | SEOUL VIOSYS CO , LTD | Light emitting diode |
D776629, | Feb 06 2015 | SEOUL VIOSYS CO , LTD | Light emitting diode |
D826184, | Mar 24 2016 | Hamamatsu Photonics K.K. | Optical semiconductor element |
D831592, | Mar 24 2016 | Hamamatsu Photonics K.K. | Optical semiconductor element |
D831593, | Mar 24 2016 | Hamamatsu Photonics K.K | Optical semiconductor element |
D832802, | Mar 24 2016 | Hamamatsu Photonics K.K. | Optical semiconductor element |
D837171, | May 07 2018 | ADURA, LLC | Circuit board having arrangements of light-emitting diodes |
D846511, | Mar 24 2016 | Hamamatsu Photonics K.K. | Optical semiconductor element |
D846512, | Mar 24 2016 | Hamamatsu Photonics K.K. | Optical semiconductor element |
D856948, | May 07 2018 | ADURA, LLC | Circuit board having arrangements of light-emitting diodes |
Patent | Priority | Assignee | Title |
6093940, | Apr 14 1997 | ROHM CO , LTD | Light-emitting diode chip component and a light-emitting device |
6310900, | Apr 30 1998 | Northrop Grumman Systems Corporation | Laser diode package with heat sink |
6495861, | Mar 18 1999 | Ròhm Co., Ltd. | Light-emitting semiconductor chip |
6777719, | Mar 19 1999 | Rohm Co., Ltd. | Chip light-emitting device |
20040099874, | |||
D416236, | Sep 02 1998 | SII CRYSTAL TECHNOLOGY INC | Integrated circuit package |
D475982, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 14 2004 | WANG, BILY | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015510 | /0914 | |
Jun 14 2004 | CHUANG, JONNIE | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015510 | /0914 | |
Jun 14 2004 | HUANG, HUI YEN | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015510 | /0914 | |
Jun 23 2004 | Harvatek Corporation | (assignment on the face of the patent) | / |
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