FIG. 1 is a top perspective view of a light emitting diode (LED) package showing our design according to one embodiment;
FIG. 2 is a bottom perspective view thereof, opposite the view of FIG. 1;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof, opposite the view of FIG. 3;
FIG. 5 is a first side view thereof;
FIG. 6 is a second side view thereof, opposite the view of FIG. 5;
FIG. 7 is a third side view thereof;
FIG. 8 is a fourth side view thereof, opposite the view of FIG. 7;
FIG. 9 is a top perspective view of a light emitting diode (LED) package showing our design according to a second embodiment;
FIG. 10 is a bottom perspective view thereof, opposite the view of FIG. 9;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof, opposite the view of FIG. 11;
FIG. 13 is a first side view thereof;
FIG. 14 is a second side view thereof, opposite the view of FIG. 13;
FIG. 15 is a third side view thereof;
FIG. 16 is a fourth side view thereof, opposite the view of FIG. 15;
FIG. 17 is a top perspective view of a light emitting diode (LED) package showing our design according to a third embodiment;
FIG. 18 is a bottom perspective view thereof, opposite the view of FIG. 17;
FIG. 19 is a top plan view thereof;
FIG. 20 is a bottom plan view thereof, opposite the view of FIG. 19;
FIG. 21 is a first side view thereof;
FIG. 22 is a second side view thereof, opposite the view of FIG. 21;
FIG. 23 is a third side view thereof;
FIG. 24 is a fourth side view thereof, opposite the view of FIG. 23;
FIG. 25 is a top perspective view of a light emitting diode (LED) package showing our design according to a fourth embodiment;
FIG. 26 is a bottom perspective view thereof, opposite the view of FIG. 25;
FIG. 27 is a top plan view thereof;
FIG. 28 is a bottom plan view thereof, opposite the view of FIG. 27;
FIG. 29 is a first side view thereof;
FIG. 30 is a second side view thereof, opposite the view of FIG. 29;
FIG. 31 is a third side view thereof; and,
FIG. 32 is a fourth side view thereof, opposite the view of FIG. 31.
The uniformly broken lines are for illustrative purposes only and form no part of the claimed design.
The dot-dash-dot broken lines (e.g., in FIG. 17) represent boundaries of the claimed design and form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
4946547, |
Oct 13 1989 |
Cree, Inc |
Method of preparing silicon carbide surfaces for crystal growth |
5200022, |
Oct 03 1990 |
Cree, Inc |
Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
6686609, |
Oct 01 2002 |
Ultrastar Limited |
Package structure of surface mounting led and method of manufacturing the same |
6936855, |
Jan 16 2002 |
EPISTAR CORPORATION |
Bendable high flux LED array |
6953255, |
Oct 09 2001 |
CITIZEN ELECTRONICS CO , LTD |
Edge light for a lighting panel |
7066626, |
Apr 09 2003 |
Citizen Electronics Co., Ltd. |
LED lamp |
7213940, |
Dec 21 2005 |
IDEAL Industries Lighting LLC |
Lighting device and lighting method |
7791061, |
May 18 2004 |
CREELED, INC |
External extraction light emitting diode based upon crystallographic faceted surfaces |
8058088, |
Jan 15 2008 |
CREE LED, INC |
Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
8267550, |
Jun 09 2010 |
Chin-Wen, Wang; Leader Trend Technology Corp. |
LED lamp for easy assembly and fixation |
8563339, |
Aug 25 2005 |
CREELED, INC |
System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
8748915, |
Apr 24 2006 |
CREELED, INC |
Emitter package with angled or vertical LED |
20030067761, |
|
|
|
20040056265, |
|
|
|
20050184387, |
|
|
|
20050219835, |
|
|
|
20050221519, |
|
|
|
20060012299, |
|
|
|
20060113906, |
|
|
|
20060157722, |
|
|
|
20060220046, |
|
|
|
20070228387, |
|
|
|
20080036362, |
|
|
|
20080173884, |
|
|
|
20080179611, |
|
|
|
20080224608, |
|
|
|
20090057699, |
|
|
|
20090057901, |
|
|
|
20090108281, |
|
|
|
20090315057, |
|
|
|
20100155763, |
|
|
|
20100212942, |
|
|
|
20100252851, |
|
|
|
20100301367, |
|
|
|
20110018017, |
|
|
|
20110062471, |
|
|
|
20110079801, |
|
|
|
20110089465, |
|
|
|
20110220929, |
|
|
|
20110273079, |
|
|
|
20110309396, |
|
|
|
20120299022, |
|
|
|
20120305949, |
|
|
|
20130087822, |
|
|
|
20130099265, |
|
|
|
20130193468, |
|
|
|
20130256711, |
|
|
|
20130270592, |
|
|
|
20130279169, |
|
|
|
20140291715, |
|
|
|
CNL201330359083X, |
|
|
|
D511328, |
Jun 23 2004 |
Harvatek Corporation |
Light-emitting diode |
D572210, |
Nov 01 2006 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Light-emitting diode (LED) |
D615504, |
Oct 31 2007 |
CREELED, INC |
Emitter package |
D615505, |
Jul 27 2009 |
LUMILEDS HOLDING B V |
LED package |
D628966, |
Dec 22 2009 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light-emitting diode |
D631020, |
Apr 29 2010 |
Edison Opto Corporation |
LED package |
D633631, |
Dec 14 2007 |
CREELED, INC |
Light source of light emitting diode |
D637565, |
Nov 02 2010 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Light emitting diode |
D642143, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D645416, |
Dec 22 2009 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light-emitting diode |
D649943, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D649944, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D656906, |
Jan 10 2008 |
CREELED, INC |
LED package |
D660813, |
Aug 26 2010 |
CITIZEN WATCH CO , LTD |
Light-emitting diode |
D662902, |
Dec 14 2007 |
CREELED, INC |
LED package |
D667802, |
Mar 09 2011 |
CITIZEN WATCH CO , LTD |
Light-emitting diode |
D670010, |
Jul 23 2010 |
Everlight Electronics Co., Ltd. |
Light emitting diode |
D680504, |
Jul 30 2010 |
Nichia Corporation |
Light emitting diode |
D698323, |
Jul 30 2010 |
Nichia Corporation |
Light emitting diode |
D698741, |
May 29 2012 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
D710810, |
Jul 30 2010 |
Nichia Corporation |
Light emitting diode |
D711840, |
Jun 11 2012 |
CREELED, INC |
LED package |
D718258, |
Sep 02 2012 |
CREELED, INC |
LED package |
D718725, |
Aug 01 2013 |
CREELED, INC |
LED package with encapsulant |
JP140389, |
|
|
|
JP2000022218, |
|
|
|
JP2001160630, |
|
|
|
JP2006093435, |
|
|
|
JP2007189006, |
|
|
|
KR100829910, |
|
|
|
KR100933920, |
|
|
|
KR1020100008509, |
|
|
|
KR1020110111941, |
|
|
|
KR2009146935, |
|
|
|
RE34861, |
Oct 09 1990 |
North Carolina State University |
Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
TW140389, |
|
|
|
TW162119, |
|
|
|
WO2013148823, |
|
|
|
WO2013148826, |
|
|
|
WO2014120256, |
|
|
|