Patent
   D475982
Priority
Mar 11 2002
Filed
Sep 10 2002
Issued
Jun 17 2003
Expiry
Jun 17 2017
Assg.orig
Entity
unknown
29
9
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;

FIG. 8 is a rear perspective view thereof;

FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 11 is a front elevational view thereof; and,

FIG. 12 is a rear elevational view thereof.

Hori, Tetsuji, Yoshihira, Takayuki, Hiyama, Yuuji, Ookura, Gentaro

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 12 2002HORI, TETSUJIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132770756 pdf
Aug 12 2002YOSHIHIRA, TAKAYUKIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132770756 pdf
Aug 12 2002HIYAMA, YUUJIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132770756 pdf
Aug 12 2002OOKURA, GENTAROKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132770756 pdf
Sep 10 2002Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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