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Patent
D626922
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Priority
Feb 23 2010
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Filed
Feb 23 2010
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Issued
Nov 09 2010
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Expiry
Nov 09 2024
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Assg.orig
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Entity
unknown
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15
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11
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n/a
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The ornamental design for a light-emitting diode, as shown and described here.
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FIG. 1 is a top perspective view of the light-emitting diode showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
Wada, Takahiro
Patent |
Priority |
Assignee |
Title |
D676002, |
Jul 07 2011 |
CITIZEN WATCH CO , LTD |
Light-emitting diode |
D694201, |
Mar 30 2012 |
CITIZEN WATCH CO , LTD |
Light-emitting diode |
D719535, |
Dec 06 2012 |
CITIZEN WATCH CO , LTD |
Light-emitting diode |
D738027, |
Nov 18 2013 |
OLEDWORKS GMBH |
Illuminated OLED panel |
D756942, |
May 06 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Light-emitting diode package |
D761215, |
May 06 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Package for light-emitting diode |
D768095, |
Oct 08 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Light-emitting diode package |
D825500, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D826184, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D831592, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D831593, |
Mar 24 2016 |
Hamamatsu Photonics K.K |
Optical semiconductor element |
D832802, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D846511, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D846512, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
ER4525, |
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Patent |
Priority |
Assignee |
Title |
6677667, |
Nov 28 2000 |
National Semiconductor Corporation |
Leadless leadframe package design that provides a greater structural integrity |
6734536, |
Jan 12 2001 |
Rohm Co., Ltd. |
Surface-mounting semiconductor device and method of making the same |
7298034, |
Jun 28 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Multi-chip semiconductor connector assemblies |
20020121684, |
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|
20030122225, |
|
|
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20090057855, |
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|
D475982, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D578490, |
Sep 07 2007 |
SAMSUNG ELECTRONICS CO , LTD |
Light-emitting diode |
D578969, |
Mar 30 2007 |
Rohm Co., Ltd. |
Light emitting diode module |
D582865, |
Jun 11 2007 |
CREE LED, INC |
LED chip |
D600658, |
May 13 2008 |
CITIZEN ELECTRONICS CO , LTD |
Light-emitting diode |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a