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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof; the opposite side being a mirror image thereof;
FIG. 3 is a right side elevational view thereof; the opposite side being a mirror image thereof;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
Kamidoi, Hiroshi, Ishihara, Toshiya
| Patent | Priority | Assignee | Title |
| 7362586, | May 07 2004 | Murata Manufacturing Co., Ltd. | Electronic component with shielding case and method of manufacturing the same |
| D675582, | Jun 27 2011 | UI TECHNOLOGIES, INC | Chip assembly |
| D676002, | Jul 07 2011 | CITIZEN WATCH CO , LTD | Light-emitting diode |
| D710811, | Feb 08 2013 | EPISTAR CORPORATION | Light-emitting diode |
| D719535, | Dec 06 2012 | CITIZEN WATCH CO , LTD | Light-emitting diode |
| D744965, | Feb 08 2013 | EPISTAR CORPORATION | Light emitting diode |
| D778846, | Dec 15 2014 | KINGBRIGHT ELECTRONICS CO. LTD. | LED component |
| D778847, | Dec 15 2014 | KINGBRIGHT ELECTRONICS CO. LTD. | LED component |
| D780135, | Feb 08 2013 | EPISTAR CORPORATION | Light-emitting diode |
| D847102, | Feb 08 2013 | EPISTAR CORPORATION | Light emitting diode |
| Patent | Priority | Assignee | Title |
| 5353201, | Nov 25 1991 | Funai Electric Co., Ltd. | Shield device for printed circuit boards |
| 5559676, | Jun 07 1995 | NV BALLON EXPRESS | Self-contained drop-in component |
| 5635670, | Jul 27 1992 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| 6377464, | Jan 29 1999 | Skyworks Solutions, Inc | Multiple chip module with integrated RF capabilities |
| 6735087, | Jan 23 2002 | Mitsubishi Denki Kabushiki Kaisha | Module and surface-mounted module |
| 6794762, | Feb 27 2002 | NEC Electronics Corporation | Electronic component and fabrication method thereof |
| 20040164395, | |||
| D383063, | Feb 10 1993 | Container with cover | |
| D444132, | Aug 23 2000 | Kabushiki Kaisha Toshiba | Semiconductor element |
| D475355, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
| D475982, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
| D476962, | Mar 29 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP1128312, | |||
| JP1149716, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 15 2004 | KAMIDOI, HIROSHI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015030 | /0423 | |
| Jan 15 2004 | ISHIHARA, TOSHIYA | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015030 | /0423 | |
| Feb 27 2004 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / |
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