Patent
   D514074
Priority
Aug 27 2003
Filed
Feb 27 2004
Issued
Jan 31 2006
Expiry
Jan 31 2020
Assg.orig
Entity
unknown
10
14
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof; the opposite side being a mirror image thereof;

FIG. 3 is a right side elevational view thereof; the opposite side being a mirror image thereof;

FIG. 4 is a top plan view thereof; and,

FIG. 5 is a bottom plan view thereof.

Kamidoi, Hiroshi, Ishihara, Toshiya

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 15 2004KAMIDOI, HIROSHIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0150300423 pdf
Jan 15 2004ISHIHARA, TOSHIYAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0150300423 pdf
Feb 27 2004Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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