Patent
   D640995
Priority
Sep 27 2010
Filed
Sep 27 2010
Issued
Jul 05 2011
Expiry
Jul 05 2025
Assg.orig
Entity
unknown
20
13
n/a
The ornamental design for a “packing structure of light-emitting diode,” as shown and described.

FIG. 1 is a perspective view of a “packing structure of light-emitting diode” showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines showing portion of the packing structure of light emitting diode is for illustrative purposes only and form no part of the claimed design.

Chen, Yi-Nan, Lin, Chen-Hsiu, Lee, Yi-Fei

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 24 2010LIN, CHEN-HSIULite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250450117 pdf
Sep 24 2010LEE, YI-FEILite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250450117 pdf
Sep 24 2010CHEN, YI-NANLite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250450117 pdf
Sep 27 2010Lite-On Technology Corporation(assignment on the face of the patent)
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