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Patent
D668623
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Priority
Jun 29 2011
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Filed
Nov 21 2011
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Issued
Oct 09 2012
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Expiry
Oct 09 2026
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Assg.orig
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Entity
unknown
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5
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15
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n/a
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I claim the ornamental design for light emitting diode package, as shown and described.
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FIG. 1 is a front perspective view of light emitting diode package showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Hsu, Hui-Kai
Patent |
Priority |
Assignee |
Title |
20070063213, |
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20070096114, |
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20110127566, |
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20110186873, |
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20110241030, |
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D622680, |
Dec 04 2009 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Package of a light emitting diode |
D627310, |
Nov 27 2009 |
Lite-On Technology Corp. |
Package of a light emitting diode |
D634284, |
Feb 10 2010 |
Lextar Electronics Corporation |
Lead frame |
D640994, |
Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
D640995, |
Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
D640996, |
Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
D644617, |
Jul 20 2010 |
PANASONIC HOLDINGS CORPORATION |
Light emitting diode case |
D645425, |
Feb 01 2011 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Light emitting diode carrier |
D656106, |
Jan 07 2011 |
Lextar Electronics Corp. |
Light emitting diode lead-frame |
D656107, |
Jan 07 2011 |
Lextar Electronics Corp. |
Light emitting diode package |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a