Patent
   D640994
Priority
Sep 27 2010
Filed
Sep 27 2010
Issued
Jul 05 2011
Expiry
Jul 05 2025
Assg.orig
Entity
unknown
9
13
n/a
The ornamental design for a “packing structure of light-emitting diode,” as shown and described.

FIG. 1 is a perspective view of a “packing structure of light-emitting diode” showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines showing portion of the packing structure of light emitting diode is for illustrative purposes only and form no part of the claimed design.

Lin, Chen-Hsiu, Lee, Yi-Fei, Chen, Wen-Nan

Patent Priority Assignee Title
D656107, Jan 07 2011 Lextar Electronics Corp. Light emitting diode package
D664108, May 26 2011 Lextar Electronics Corp. Light emitting diode lead-frame
D664109, May 26 2011 Lextar Electronics Corp. Light emitting diode lead-frame
D668623, Jun 29 2011 Lextar Electronics Corp. Light emitting diode package
D669044, Jun 29 2011 Lextar Electronics Corp. Light emitting diode lead-frame
D670663, Nov 09 2011 Lextar Electronics, Corp. Light emitting diode lead-frame
D675170, Nov 09 2011 Lextar Electronics Corp. Light emitting diode lead-frame
D689029, May 24 2011 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Portion of substrate for LED package
D689030, May 24 2011 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Portion of substrate for LED package
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 24 2010LIN, CHEN-HSIULite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250440976 pdf
Sep 24 2010LEE, YI-FEILite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250440976 pdf
Sep 24 2010CHEN, WEN-NANLite-On Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0250440976 pdf
Sep 27 2010Lite-On Technology Corporation(assignment on the face of the patent)
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