Patent
   D689029
Priority
May 24 2011
Filed
Nov 23 2011
Issued
Sep 03 2013
Expiry
Sep 03 2027
Assg.orig
Entity
unknown
1
27
n/a
The ornamental design for a portion of substrate for led package, as shown and described.

FIG. 1 is a perspective view of the portion of substrate for LED package showing our new design;

FIG. 2 is a front view thereof, the rear view being a mirror image thereof;

FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.

The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.

Bak, Gyu Hyeong, Min, Bong Kul

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 23 2011LG Innotek Co., Ltd.(assignment on the face of the patent)
Nov 25 2011MIN, BONG KULLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274410417 pdf
Nov 25 2011BAK, GYU HYEONGLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274410417 pdf
May 20 2021LG INNOTEK CO , LTD SUZHOU LEKIN SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0563660335 pdf
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