Patent
   D664110
Priority
May 24 2011
Filed
Nov 23 2011
Issued
Jul 24 2012
Expiry
Jul 24 2026
Assg.orig
Entity
unknown
2
8
n/a
The ornamental design for a substrate for led package, as shown and described.

FIG. 1 is a perspective view of the substrate for LED package showing our new design;

FIG. 2 is a front view thereof, the rear view being a mirror image thereof;

FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.

The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.

Bak, Gyu Hyeong, Min, Bong Kul

Patent Priority Assignee Title
D689029, May 24 2011 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Portion of substrate for LED package
D689030, May 24 2011 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Portion of substrate for LED package
Patent Priority Assignee Title
20070096114,
20110127566,
20110241030,
20120074451,
D634284, Feb 10 2010 Lextar Electronics Corporation Lead frame
D638378, Feb 10 2010 Lextar Electronics Corporation Lead frame
D645425, Feb 01 2011 LITE-ON ELECTRONICS GUANGZHOU LIMITED Light emitting diode carrier
D652808, Jan 10 2011 Advanced Optoelectronic Technology, Inc. Light-emitting diode encapsulating structure
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 23 2011LG Innotek Co., Ltd.(assignment on the face of the patent)
Nov 25 2011MIN, BONG KULLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0275080826 pdf
Nov 25 2011BAK, GYU HYEONGLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0275080826 pdf
May 20 2021LG INNOTEK CO , LTD SUZHOU LEKIN SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0563660335 pdf
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