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Patent
D664110
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Priority
May 24 2011
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Filed
Nov 23 2011
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Issued
Jul 24 2012
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Expiry
Jul 24 2026
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Assg.orig
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Entity
unknown
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2
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8
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The ornamental design for a substrate for led package, as shown and described.
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FIG. 1 is a perspective view of the substrate for LED package showing our new design;
FIG. 2 is a front view thereof, the rear view being a mirror image thereof;
FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.
The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.
Bak, Gyu Hyeong, Min, Bong Kul
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