Patent
   D652808
Priority
Jan 10 2011
Filed
May 13 2011
Issued
Jan 24 2012
Expiry
Jan 24 2026
Assg.orig
Entity
unknown
8
11
n/a
The ornamental design for a light-emitting diode encapsulating structure, as shown and described.

FIG. 1 is a perspective view of a light-emitting diode encapsulating structure showing our new design.

FIG. 2 is a front elevational view of the light-emitting diode encapsulating structure of FIG. 1.

FIG. 3 is a rear elevational view of the light-emitting diode encapsulating structure of FIG. 1.

FIG. 4 is a left-side, elevational view of the light-emitting diode encapsulating structure of FIG. 1.

FIG. 5 is a right-side, elevational view of the light-emitting diode encapsulating structure of FIG. 1.

FIG. 6 is a top plan view of the light-emitting diode encapsulating structure of FIG. 1; and,

FIG. 7 is a bottom plan view of the light-emitting diode encapsulating structure of FIG. 1.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Chang, Yu-Fen, Kuo, Te-Wen

Patent Priority Assignee Title
D664110, May 24 2011 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Substrate for LED package
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 10 2011CHANG, YU-FENADVANCED OPTOELECTRONIC TECHNOLOGY, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0262730192 pdf
May 10 2011KUO, TE-WENADVANCED OPTOELECTRONIC TECHNOLOGY, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0262730192 pdf
May 13 2011Advanced Optoelectronic Technology, Inc.(assignment on the face of the patent)
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