Patent
   D627310
Priority
Nov 27 2009
Filed
Mar 02 2010
Issued
Nov 16 2010
Expiry
Nov 16 2024
Assg.orig
Entity
unknown
58
12
n/a
The ornamental design for package of a light emitting diode, as shown and described.

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The portions shown in dashed lines do not form part of the design.

Lin, Chen-Hsiu, Wu, Chia-Hao

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Feb 11 2010LIN, CHEN-HSIULITE-ON TECHNOLOGY CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0240170916 pdf
Feb 11 2010WU, CHIA-HAOLITE-ON TECHNOLOGY CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0240170916 pdf
Mar 02 2010Lite-On Technology Corp.(assignment on the face of the patent)
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