FIG. 1 is a top perspective view of an high brightness LED package showing our design;
FIG. 2 is a side view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a side view thereof opposite the view of FIG. 2;
FIG. 5 is a bottom view thereof opposite the view of FIG. 3;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The dashed broken lines are for illustrative purposes only and form no part of the claimed design. The dot-dash broken lines represent boundaries of the claimed design. None of the broken lines form part of the claimed design.
	
	  
 	  	 | Patent | 
	  	 Priority | 
	  	 Assignee | 
	  	 Title | 
	  
	      
	 | 11101408,  | 
	 Feb 07 2011 | 
	 CREELED, INC  | 
	 Components and methods for light emitting diode (LED) lighting | 
	 
    
	 | 8610140,  | 
	 Dec 15 2010 | 
	 CREELED, INC  | 
	 Light emitting diode (LED) packages, systems, devices and related methods | 
	 
    
	 | 8648359,  | 
	 Jun 28 2010 | 
	 CREELED, INC  | 
	 Light emitting devices and methods | 
	 
    
	 | 8686445,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Solid state lighting devices and methods | 
	 
    
	 | 8860043,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Light emitting device packages, systems and methods | 
	 
    
	 | 8866166,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Solid state lighting device | 
	 
    
	 | 8878217,  | 
	 Jun 28 2010 | 
	 CREELED, INC  | 
	 LED package with efficient, isolated thermal path | 
	 
    
	 | 9111778,  | 
	 Dec 15 2010 | 
	 CREELED, INC  | 
	 Light emitting diode (LED) devices, systems, and methods | 
	 
    
	 | 9123874,  | 
	 Jan 12 2009 | 
	 Cree, Inc. | 
	 Light emitting device packages with improved heat transfer | 
	 
    
	 | 9859471,  | 
	 Jan 31 2011 | 
	 CREELED, INC  | 
	 High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion | 
	 
    
	 | D704358,  | 
	 Jan 03 2011 | 
	 CREELED, INC  | 
	 High brightness LED package | 
	 
    
	 | D708156,  | 
	 Jul 16 2010 | 
	 CREELED, INC  | 
	 Package for light emitting diode (LED) lighting | 
	 
    
	 | ER5174,  | 
	  | 
	  | 
	  | 
	 
	
	
	  
 	  	 | Patent | 
	  	 Priority | 
	  	 Assignee | 
	  	 Title | 
	  
	      
	 | 4679118,  | 
	 Aug 07 1984 | 
	 Aavid Engineering, Inc. | 
	 Electronic chip-carrier heat sinks | 
	 
    
	 | 4946547,  | 
	 Oct 13 1989 | 
	 Cree, Inc | 
	 Method of preparing silicon carbide surfaces for crystal growth | 
	 
    
	 | 5200022,  | 
	 Oct 03 1990 | 
	 Cree, Inc | 
	 Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product | 
	 
    
	 | 5210051,  | 
	 Mar 27 1990 | 
	 Cree, Inc | 
	 High efficiency light emitting diodes from bipolar gallium nitride | 
	 
    
	 | 5393993,  | 
	 Dec 13 1993 | 
	 Cree, Inc | 
	 Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices | 
	 
    
	 | 5506446,  | 
	 Apr 14 1994 | 
	 Advanced Technology Interconnect Incorporated | 
	 Electronic package having improved wire bonding capability | 
	 
    
	 | 5523589,  | 
	 Sep 20 1994 | 
	 Cree, Inc | 
	 Vertical geometry light emitting diode with group III nitride active layer and extended lifetime | 
	 
    
	 | 6274924,  | 
	 Nov 05 1998 | 
	 Lumileds LLC | 
	 Surface mountable LED package | 
	 
    
	 | 6610563,  | 
	 Dec 15 1997 | 
	 Osram GmbH | 
	 Surface mounting optoelectronic component and method for producing same | 
	 
    
	 | 6828170,  | 
	 Mar 15 1999 | 
	 Gentex Corporation | 
	 Method of making a semiconductor radiation emitter package | 
	 
    
	 | 6936855,  | 
	 Jan 16 2002 | 
	 EPISTAR CORPORATION | 
	 Bendable high flux LED array | 
	 
    
	 | 6943433,  | 
	 Mar 06 2002 | 
	 Nichia Corporation | 
	 Semiconductor device and manufacturing method for same | 
	 
    
	 | 7081661,  | 
	 Mar 16 2001 | 
	 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD  | 
	 High-frequency module and method for manufacturing the same | 
	 
    
	 | 7224047,  | 
	 Dec 18 2004 | 
	 Bell Semiconductor, LLC | 
	 Semiconductor device package with reduced leakage | 
	 
    
	 | 7244965,  | 
	 Sep 04 2002 | 
	 CREELED, INC  | 
	 Power surface mount light emitting die package | 
	 
    
	 | 7361940,  | 
	 Dec 16 2004 | 
	 Seoul Semiconductor Co., Ltd. | 
	 Leadframe and packaged light emitting diode | 
	 
    
	 | 7400049,  | 
	 Feb 16 2006 | 
	 STATS CHIPPAC PTE  LTE  | 
	 Integrated circuit package system with heat sink | 
	 
    
	 | 7429790,  | 
	 Oct 24 2005 | 
	 SHENZHEN XINGUODU TECHNOLOGY CO , LTD  | 
	 Semiconductor structure and method of manufacture | 
	 
    
	 | 7432589,  | 
	 Apr 19 2006 | 
	 Nichia Corporation | 
	 Semiconductor device | 
	 
    
	 | 7456499,  | 
	 Jun 04 2004 | 
	 CREELED, INC  | 
	 Power light emitting die package with reflecting lens and the method of making the same | 
	 
    
	 | 7462870,  | 
	 Jun 20 2003 | 
	 Nichia Corporation | 
	 Molded package and semiconductor device using molded package | 
	 
    
	 | 7564180,  | 
	 Jan 10 2005 | 
	 CREELED, INC  | 
	 Light emission device and method utilizing multiple emitters and multiple phosphors | 
	 
    
	 | 7592638,  | 
	 Oct 19 2005 | 
	 SUZHOU LEKIN SEMICONDUCTOR CO , LTD  | 
	 Light emitting diode package | 
	 
    
	 | 7692206,  | 
	 Dec 06 2002 | 
	 CREELED, INC  | 
	 Composite leadframe LED package and method of making the same | 
	 
    
	 | 7719024,  | 
	 May 10 2006 | 
	 Nichia Corporation | 
	 Semiconductor light emitting device and a method for producing the same | 
	 
    
	 | 7791061,  | 
	 May 18 2004 | 
	 CREELED, INC  | 
	 External extraction light emitting diode based upon crystallographic faceted surfaces | 
	 
    
	 | 7923739,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Solid state lighting device | 
	 
    
	 | 8269244,  | 
	 Jun 28 2010 | 
	 CREELED, INC  | 
	 LED package with efficient, isolated thermal path | 
	 
    
	 | 20010045640,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20020004251,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20040075100,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20040079957,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20040126913,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20060118808,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20060157726,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20060186418,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20060220050,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20070052074,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20070057364,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20070075325,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20070114514,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080006837,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080023722,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080185605,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080258130,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080258162,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080278941,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20080290353,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090008662,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090101921,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090159905,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090189178,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090267085,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20090321779,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100059783,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100102345,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100133554,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100133578,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100155748,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100163887,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100181582,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100270577,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20110006658,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20110031865,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20110180827,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20110186873,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20120127720,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20120153317,  | 
	  | 
	  | 
	  | 
	 
    
	 | CN2009302863975,  | 
	  | 
	  | 
	  | 
	 
    
	 | CNL201130010728,  | 
	  | 
	  | 
	  | 
	 
    
	 | D514073,  | 
	 Jul 09 2003 | 
	 Nichai Corporation | 
	 Light emitting diode | 
	 
    
	 | D566055,  | 
	 Sep 21 2006 | 
	 SUZHOU LEKIN SEMICONDUCTOR CO , LTD  | 
	 Light-emitting diode (LED) | 
	 
    
	 | D573113,  | 
	 Dec 09 2005 | 
	 Nichia Corporation | 
	 Light emitting diode | 
	 
    
	 | D573114,  | 
	 May 04 2007 | 
	 SAMSUNG ELECTRONICS CO , LTD  | 
	 Light-emitting diode | 
	 
    
	 | D580375,  | 
	 Oct 12 2006 | 
	 SEMI-PHOTONICS CO , LTD  | 
	 Lead frame for a two-pin light emitting diode device | 
	 
    
	 | D580381,  | 
	 Dec 09 2005 | 
	 Nichia Corporation | 
	 Light emitting diode | 
	 
    
	 | D580891,  | 
	 Jul 20 2007 | 
	 ALTI-SEMICONDUCTOR CO , LTD  | 
	 Light emitting diode | 
	 
    
	 | D584699,  | 
	 Dec 09 2005 | 
	 Nichia Corporation | 
	 Light emitting diode | 
	 
    
	 | D594827,  | 
	 Dec 07 2006 | 
	 CREE LED, INC  | 
	 Lamp package | 
	 
    
	 | D595675,  | 
	 Sep 24 2008 | 
	 Harvatek Corporation | 
	 Light emitting diode | 
	 
    
	 | D597968,  | 
	 Mar 13 2008 | 
	 Rohm Co., Ltd. | 
	 Light emitting diode module | 
	 
    
	 | D597971,  | 
	 Mar 13 2008 | 
	 Rohm Co., Ltd. | 
	 Light emitting diode module | 
	 
    
	 | D598400,  | 
	 Dec 09 2005 | 
	 Nichia Corporation | 
	 Light emitting diode | 
	 
    
	 | D614592,  | 
	 Aug 28 2008 | 
	 CREELED, INC  | 
	 Light emitting diode | 
	 
    
	 | D615504,  | 
	 Oct 31 2007 | 
	 CREELED, INC  | 
	 Emitter package | 
	 
    
	 | D621798,  | 
	 Aug 29 2008 | 
	 Foxsemicon Integrated Technology, Inc. | 
	 Light-emitting diode substrate | 
	 
    
	 | D621799,  | 
	 Jan 12 2009 | 
	 CREELED, INC  | 
	 Light emitting diode | 
	 
    
	 | D622680,  | 
	 Dec 04 2009 | 
	 LITE-ON ELECTRONICS  GUANGZHOU  LIMITED | 
	 Package of a light emitting diode | 
	 
    
	 | D626095,  | 
	 Dec 11 2009 | 
	 Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD  | 
	 Light emitting diode | 
	 
    
	 | D627310,  | 
	 Nov 27 2009 | 
	 Lite-On Technology Corp. | 
	 Package of a light emitting diode | 
	 
    
	 | D628541,  | 
	 Jun 14 2010 | 
	 Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD  | 
	 Light emitting diode | 
	 
    
	 | D632267,  | 
	 Feb 12 2010 | 
	 Lextar Electronics Corp. | 
	 Light emitting diode packaging carrier | 
	 
    
	 | D632659,  | 
	 Nov 11 2009 | 
	 Everlight Electronics Co., Ltd. | 
	 Light emitting diode lamp | 
	 
    
	 | D634284,  | 
	 Feb 10 2010 | 
	 Lextar Electronics Corporation | 
	 Lead frame | 
	 
    
	 | D634285,  | 
	 Feb 10 2010 | 
	 Lextar Electronics Corporation | 
	 Lead frame | 
	 
    
	 | D634286,  | 
	 Feb 10 2010 | 
	 Lextar Electronics Corporation | 
	 Lead frame | 
	 
    
	 | D634716,  | 
	 Aug 06 2009 | 
	 Toshiba Lighting & Technology Corporation | 
	 Light emitting diode illumination device | 
	 
    
	 | D635527,  | 
	 Jan 12 2009 | 
	 CREELED, INC  | 
	 Light emitting diode | 
	 
    
	 | D641719,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Light emitting diode | 
	 
    
	 | D643819,  | 
	 Jul 16 2010 | 
	 CREELED, INC  | 
	 Package for light emitting diode (LED) lighting | 
	 
    
	 | D648686,  | 
	 Apr 30 2010 | 
	 CREELED, INC  | 
	 Light emitting diode (LED) package | 
	 
    
	 | D648687,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Light emitting device package | 
	 
    
	 | D658599,  | 
	 Mar 26 2010 | 
	 Toshiba Lighting & Technology Corporation | 
	 Light emitting diode module | 
	 
    
	 | D659657,  | 
	 Apr 30 2010 | 
	 CREELED, INC  | 
	 Light emitting diode (LED) package | 
	 
    
	 | D661264,  | 
	 Jun 05 2009 | 
	 CREELED, INC  | 
	 Light emiting device package | 
	 
    
	 | EM1242234,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1102760,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1346959,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1416396,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1431637,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1433335,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP1441805,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2005179147,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2005209763,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2007108547,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2008091792,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2008103480,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2008545269,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2010034262,  | 
	  | 
	  | 
	  | 
	 
    
	 | JP2010205776,  | 
	  | 
	  | 
	  | 
	 
    
	 | KR100845856,  | 
	  | 
	  | 
	  | 
	 
    
	 | KR1020070000130,  | 
	  | 
	  | 
	  | 
	 
    
	 | KR1020090003378,  | 
	  | 
	  | 
	  | 
	 
    
	 | RE34861,  | 
	 Oct 09 1990 | 
	 North Carolina State University | 
	 Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide | 
	 
    
	 | TW100305347,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2007126720,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2008021268,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012005984,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012021238,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012050994,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012100060,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012106312,  | 
	  | 
	  | 
	  | 
	 
    
	 | WO2012109225,  | 
	  | 
	  | 
	  | 
	 
	
	
	  
	  	 | Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
	  
	  | Jan 03 2011 |  | Cree, Inc. | (assignment on the face of the patent) |  | / | 
    
    
    
| Feb 24 2011 | JOO, SUNG CHUL | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 025950 | /0219 | 
    pdf | 
    
    
| Feb 24 2011 | HUSSELL, CHRISTOPHER P  | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 025950 | /0219 | 
    pdf | 
    
    
| Mar 01 2021 | Cree, Inc | CREELED, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 055780 | /0121 | 
    pdf | 
    
    
| Feb 07 2022 | SMART MODULAR TECHNOLOGIES, INC  | CITIZENS BANK, N A  | SECURITY INTEREST  SEE DOCUMENT FOR DETAILS   | 058983 | /0001 | 
    pdf | 
    
    
| Feb 07 2022 | SMART High Reliability Solutions, LLC | CITIZENS BANK, N A  | SECURITY INTEREST  SEE DOCUMENT FOR DETAILS   | 058983 | /0001 | 
    pdf | 
    
    
| Feb 07 2022 | SMART EMBEDDED COMPUTING, INC  | CITIZENS BANK, N A  | SECURITY INTEREST  SEE DOCUMENT FOR DETAILS   | 058983 | /0001 | 
    pdf | 
    
    
| Feb 07 2022 | CREELED, INC  | CITIZENS BANK, N A  | SECURITY INTEREST  SEE DOCUMENT FOR DETAILS   | 058983 | /0001 | 
    pdf |