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Patent
D621798
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Priority
Aug 29 2008
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Filed
Jan 12 2009
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Issued
Aug 17 2010
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Expiry
Aug 17 2024
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Assg.orig
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Entity
unknown
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25
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14
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n/a
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The ornamental design for a light-emitting diode substrate, as shown and described.
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FIG. 1 is a perspective view of a light-emitting diode substrate showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof wherein the broken lines are shown for illustrative purpose only and forms no part of the claimed design.
Lu, Ying-Chieh, Chiang, Kuo-Feng, Lai, Chih-Ming
| Patent |
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Title |
| 11101408, |
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| 7923739, |
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| 8269244, |
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| 8497522, |
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| 8610140, |
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| 8648359, |
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| 8686445, |
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| 8860043, |
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| 8866166, |
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| 8878217, |
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| 9123874, |
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| 9859471, |
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| D641719, |
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| D643819, |
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| D643821, |
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| D648686, |
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| D648687, |
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| D659657, |
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| D661264, |
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| D667801, |
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| D679842, |
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| D704358, |
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| D708156, |
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| D825500, |
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| Patent |
Priority |
Assignee |
Title |
| D511329, |
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| D514073, |
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| D563333, |
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| D570796, |
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| D573114, |
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SAMSUNG ELECTRONICS CO , LTD |
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| D592160, |
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Seoul Semiconductor Co., Ltd. |
Light emitting diode (LED) |
| KR3004194070000, |
|
|
|
| KR3004194070001, |
|
|
|
| KR3004349000000, |
|
|
|
| KR3005021660000, |
|
|
|
| KR3005075850000, |
|
|
|
| TW102840, |
|
|
|
| TW102845, |
|
|
|
| TW102846, |
|
|
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| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a