Patent
   D664107
Priority
May 26 2011
Filed
Sep 23 2011
Issued
Jul 24 2012
Expiry
Jul 24 2026
Assg.orig
Entity
unknown
7
13
n/a
I claim the ornamental design for light emitting diode package, as shown and described.

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Wang, Chi-Kuon

Patent Priority Assignee Title
D697876, Nov 20 2012 Lextar Electronics Corp. Light emitting diode lead-frame
D697877, Nov 20 2012 Lextar Electronics Corp. Light emitting diode package
D709039, Sep 13 2012 Lextar Electronics Corporation Light emitting diode package
D718726, May 17 2013 Lextar Electronics Corporation Light-emitting diode package
D728492, Jul 31 2013 Lextar Electronics Corporation Light-emitting diode package
D759884, Dec 16 2014 Hon Hai Precision Industry Co., Ltd. LED encapsulation structure
D786203, Feb 24 2015 Nichia Corporation Light emitting diode
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D640996, Sep 27 2010 Lite-On Technology Corporation Packing structure of light-emitting diode
D656107, Jan 07 2011 Lextar Electronics Corp. Light emitting diode package
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Sep 20 2011WANG, CHI-KUONLextar Electronics CorpASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0269580149 pdf
Sep 23 2011Lextar Electronics Corp.(assignment on the face of the patent)
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