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Patent
D667384
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Priority
Jul 11 2011
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Filed
Nov 17 2011
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Issued
Sep 18 2012
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Expiry
Sep 18 2026
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Assg.orig
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Entity
unknown
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0
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12
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n/a
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The ornamental design for light emitting diode lead-frame, as shown and described.
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FIG. 1 is a front perspective view of light emitting diode lead-frame showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof.
Hsu, Che-Ming, Chang, Cheng-Ping, Hsu, Hui-Kai
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
20110127566, |
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|
|
20110186873, |
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|
|
20110241030, |
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|
|
D599750, |
Jun 20 2008 |
SAMSUNG ELECTRONICS CO , LTD |
Case for light emitting diode |
D622680, |
Dec 04 2009 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Package of a light emitting diode |
D626095, |
Dec 11 2009 |
Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD |
Light emitting diode |
D634284, |
Feb 10 2010 |
Lextar Electronics Corporation |
Lead frame |
D638378, |
Feb 10 2010 |
Lextar Electronics Corporation |
Lead frame |
D645425, |
Feb 01 2011 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Light emitting diode carrier |
D647070, |
Dec 22 2010 |
Lite-On Technology Corp. |
Light emitting diode carrier |
D652808, |
Jan 10 2011 |
Advanced Optoelectronic Technology, Inc. |
Light-emitting diode encapsulating structure |
D654032, |
Jan 07 2011 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Package of a light emitting diode |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a