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						 Patent  
						   D678225  
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						 Priority  
						Nov 08 2011 
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						 Filed 
						Dec 14 2011  
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						 Issued 
						Mar 19 2013 
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						 Expiry 
						Mar 19 2027 
					   
 TERM.DISCL. 
					   						
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			  The ornamental design for light emitting diode package, as shown and described. 
			  
			  
			  
			  
			 
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FIG. 1 is a front perspective view of light emitting diode package showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
	
	Wang, Chun-Wei, Ko, Bo-Yu, Lin, Sheng-Pei
	
	
	
	
	  
 	  	 | Patent | 
	  	 Priority | 
	  	 Assignee | 
	  	 Title | 
	  
	      
	 | 20070096114,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20100102348,  | 
	  | 
	  | 
	  | 
	 
    
	 | 20110127566,  | 
	  | 
	  | 
	  | 
	 
    
	 | D578084,  | 
	 Mar 30 2007 | 
	 Rohm Co., Ltd. | 
	 Light emitting diode module | 
	 
    
	 | D608309,  | 
	 Sep 01 2008 | 
	 SUZHOU LEKIN SEMICONDUCTOR CO , LTD  | 
	 Light-emitting diode (LED) | 
	 
    
	 | D628541,  | 
	 Jun 14 2010 | 
	 Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD  | 
	 Light emitting diode | 
	 
    
	 | D632267,  | 
	 Feb 12 2010 | 
	 Lextar Electronics Corp. | 
	 Light emitting diode packaging carrier | 
	 
    
	 | D635529,  | 
	 Feb 12 2010 | 
	 Lextar Electronics Corp. | 
	 Light emitting diode packaging carrier | 
	 
    
	 | D640995,  | 
	 Sep 27 2010 | 
	 Lite-On Technology Corporation | 
	 Packing structure of light-emitting diode | 
	 
    
	 | D640996,  | 
	 Sep 27 2010 | 
	 Lite-On Technology Corporation | 
	 Packing structure of light-emitting diode | 
	 
    
	 | D656107,  | 
	 Jan 07 2011 | 
	 Lextar Electronics Corp. | 
	 Light emitting diode package | 
	 
	
	
	
	
	
	  
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