FIG. 1 is a front perspective view of light emitting diode package showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another elevational view thereof.
Hsu, Che-Ming, Chang, Cheng-Ping, Hsu, Hui-Kai
Patent |
Priority |
Assignee |
Title |
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Rohm Co., Ltd. |
Light emitting diode module |
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Sep 01 2008 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Light-emitting diode (LED) |
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Jun 14 2010 |
Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD |
Light emitting diode |
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Feb 12 2010 |
Lextar Electronics Corp. |
Light emitting diode packaging carrier |
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Sep 27 2010 |
Lite-On Technology Corporation |
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Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
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