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Patent
D668235
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Priority
Jul 11 2011
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Filed
Nov 17 2011
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Issued
Oct 02 2012
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Expiry
Oct 02 2026
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Assg.orig
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Entity
unknown
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6
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7
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n/a
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The ornamental design for light emitting diode package, as shown and described.
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FIG. 1 is a front perspective view of light emitting diode package showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another elevational view thereof.
Hsu, Che-Ming, Chang, Cheng-Ping, Hsu, Hui-Kai
Patent |
Priority |
Assignee |
Title |
20110127566, |
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|
|
D578084, |
Mar 30 2007 |
Rohm Co., Ltd. |
Light emitting diode module |
D608309, |
Sep 01 2008 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Light-emitting diode (LED) |
D628541, |
Jun 14 2010 |
Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD |
Light emitting diode |
D632267, |
Feb 12 2010 |
Lextar Electronics Corp. |
Light emitting diode packaging carrier |
D640995, |
Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
D640996, |
Sep 27 2010 |
Lite-On Technology Corporation |
Packing structure of light-emitting diode |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a