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Patent
D904325
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Priority
Mar 20 2019
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Filed
Sep 13 2019
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Issued
Dec 08 2020
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Expiry
Dec 08 2035
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Assg.orig
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Entity
unknown
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21
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37
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a rear perspective view of a semiconductor module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top view thereof, the bottom view is a mirror image of the top view;
FIG. 4 is a left side view thereof;
FIG. 5 is a rear view thereof; and,
FIG. 6 is a right side view thereof.
Omichi, Takanori
Patent |
Priority |
Assignee |
Title |
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Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using heuristic models |
11662698, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using machine learning models |
11747775, |
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CACI, Inc.—Federal |
Integrated tamper detection system and methods |
D920937, |
Mar 29 2019 |
SHINDENGEN ELECTRIC MANUFACTURING CO , LTD |
Power module device containing semiconductor elements |
D934188, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934189, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934190, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934820, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D934821, |
Jul 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D934822, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D937232, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D937233, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D938925, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D945384, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Semiconductor module |
D947800, |
Jul 16 2019 |
CACI, Inc.—Federal |
Integrated module |
D969761, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D974311, |
Jul 31 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D975666, |
Jul 31 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D981354, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981355, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
ER7497, |
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Samsung Electronics Co., Ltd. |
Semiconductor module |
D432505, |
Aug 06 1997 |
Sony Corporation |
Semiconductor element |
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Aug 23 2000 |
Kabushiki Kaisha Toshiba |
Semiconductor element |
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Feb 15 2001 |
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Semiconductor device |
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Feb 15 2001 |
Mitsubishi Denki Kabushiki Kaisha |
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Feb 15 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
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Feb 15 2001 |
Mitsubishi Denki Kabushiki Kaishi |
Semiconductor device |
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Feb 15 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D461171, |
Feb 15 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D475028, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
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Kabushiki Kaisha Toshiba |
Semiconductor device |
D475982, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D476962, |
Mar 29 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D504874, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D508682, |
Feb 23 2004 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D510728, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D521952, |
Feb 23 2004 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D540272, |
Apr 18 2005 |
Murata Manufacturing Co., Ltd. |
Semiconductor module |
D706733, |
Sep 16 2013 |
AIO CORE CO , LTD |
Signal conversion device |
D707193, |
Sep 16 2013 |
AIO CORE CO , LTD |
Signal conversion device |
D721047, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
D813182, |
Aug 02 2016 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Semiconductor device |
D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D832228, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a