Patent
   D904325
Priority
Mar 20 2019
Filed
Sep 13 2019
Issued
Dec 08 2020
Expiry
Dec 08 2035
Assg.orig
Entity
unknown
20
37
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a rear perspective view of a semiconductor module showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a top view thereof, the bottom view is a mirror image of the top view;

FIG. 4 is a left side view thereof;

FIG. 5 is a rear view thereof; and,

FIG. 6 is a right side view thereof.

Omichi, Takanori

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Sep 04 2019OMICHI, TAKANORISansha Electric Manufacturing Company, LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503950311 pdf
Sep 13 2019Sansha Electric Manufacturing Company, Limited(assignment on the face of the patent)
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