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The ornamental design for a semiconductor module, as shown and described. |
FIG. 1 is a perspective view showing our design;
FIG. 2 is a front view thereof
FIG. 3 is a rear view thereof;
FIG. 4 is a right-hand side view thereof;
FIG. 5 is a left-hand side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Song, Young-hee, Jeon, Jun-young, Oh, Se-Yong, Sohn, Hai-jeong
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 15 2000 | JEON, JUN-YOUNG | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010551 | /0213 | |
Jan 15 2000 | OH, SE-YONG | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010551 | /0213 | |
Jan 15 2000 | SOHN, HAI-JEONG | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010551 | /0213 | |
Jan 15 2000 | SONG, YOUNG-HEE | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010551 | /0213 | |
Jan 24 2000 | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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