The ornamental design for a semiconductormodule, as shown and described.
FIG. 1 is a front view of a semiconductor module according to our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a top side view of the semiconductor module of FIG. 1;
FIG. 4 is a bottom side view of the semiconductor module of FIG. 1;
FIG. 5 is a left view of the semiconductor module of FIG. 1;
FIG. 6 is a right view of the semiconductor module of FIG. 1; and,
FIG. 7 is a perspective view illustrating the front, the top, and the left side of the semiconductor module of FIG. 1.
The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, the bottom view, and the perspective view represents a shape of a three-dimensional shape.