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Patent
D827593
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Priority
Nov 28 2014
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Filed
Jan 05 2018
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Issued
Sep 04 2018
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Expiry
Sep 04 2033
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Assg.orig
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Entity
unknown
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9
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63
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a front view of a semiconductor module showing our new design.
FIG. 2 is a rear view of the semiconductor module of FIG. 1.
FIG. 3 is a left side view of the semiconductor module of FIG. 1.
FIG. 4 is a right side view of the semiconductor module of FIG. 1.
FIG. 5 is a top view of the semiconductor module of FIG. 1.
FIG. 6 is a bottom view of the semiconductor module of FIG. 1.
FIG. 7 is a front, right, and bottom perspective view of the semiconductor module of FIG. 1; and,
FIG. 8 is a rear, left, and top perspective view of the semiconductor module of FIG. 1.
The broken lines shown in the drawing views of FIGS. 1-8 form no part of the claimed design.
Soyano, Shin, Koyama, Takahiro, Higuchi, Keiichi, Takamiya, Yoshikazu
Patent |
Priority |
Assignee |
Title |
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Sep 07 2017 |
ROHM CO , LTD |
Power semiconductor module |
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Sep 29 2017 |
ROHM CO , LTD |
Power semiconductor module |
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Power semiconductor module |
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Rohm Co., Ltd. |
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Semiconductor module |
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Fuji Electric Co., Ltd. |
Semiconductor module |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a