PTO
Wrapper
PDF
Dossier
Espace
Google
Patent
D724554
Priority
Feb 19 2014
Filed
May 22 2014
Issued
Mar 17 2015
Expiry
Mar 17 2029
Assg.orig
Entity
unknown
6
32
n/a
The ornamental design for a semiconductor module , as shown and described.
FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1 ;
FIG. 3 is a left side view of the semiconductor module of FIG. 1 ;
FIG. 4 is a right side view of the semiconductor module of FIG. 1 ;
FIG. 5 is a top view of the semiconductor module of FIG. 1 ;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1 ; and,
FIG. 7 is a top, front and right side perspective view of the semiconductor module of FIG. 1 .
The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals projects from the top surface. Each end in a longitudinal direction includes a mounting hole. Each corner includes a positioning boss.
Takahashi, Hideaki , Motohashi, Satoru , Terashima, Kenshi , Karasawa, Tatsuya
Patent
Priority
Assignee
Title
D761745 ,
Jun 28 2013
Sumitomo Electric Industries, Ltd.
Semiconductor device
D772184 ,
Dec 24 2014
Fuji Electric Co., Ltd.
Semiconductor module
D774479 ,
Nov 28 2014
Fuji Electric Co., Ltd.
Semiconductor module
D810706 ,
Dec 24 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
D814433 ,
Nov 28 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
D827593 ,
Nov 28 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
Patent
Priority
Assignee
Title
5031462 ,
May 08 1989
Honeywell Inc.
Snap-fit construction low cost pressure sensing device
5184107 ,
Jan 28 1991
Honeywell, Inc.
Piezoresistive pressure transducer with a conductive elastomeric seal
D318646 ,
Dec 30 1988
Honeywell INC
Differential pressure transducer
D390833 ,
Sep 09 1996
Fujikura Ltd.
Piezolectric conversion type semiconductor device
D395423 ,
Mar 13 1997
Sony Corporation
Semiconductor package
D396696 ,
Jan 30 1997
Sony Corporation
Semiconductor package
D432095 ,
Oct 09 1998
Vishay Semiconductor GmbH
Light-emitting semi-conductor component
D436085 ,
Jun 18 1999
Fujikura Ltd
Piezoelectric conversion type semiconductor device
D441726 ,
Jul 14 1999
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
Semiconductor element
D472529 ,
Jan 17 2002
Sony Corporation
Semiconductor element
D472531 ,
Jun 25 2002
Sony Corporation
Semiconductor element
D485242 ,
Jan 17 2002
Sony Corporation
Semiconductor element
D493152 ,
Nov 27 2002
LENOVO INTERNATIONAL LIMITED
Server blade chassis midplane printed circuit board with cover
D505923 ,
Nov 13 2003
Sony Corporation
Semiconductor element
D505924 ,
Nov 13 2003
Sony Corporation
Semiconductor element
D554084 ,
Oct 31 2005
Kabushiki Kaisha Toshiba
Portion of a semiconductor apparatus mounting-position accuracy measurement jig
D576577 ,
Nov 30 2006
Kabushiki Kaisha Toshiba
Portion of a printed circuit board
D587662 ,
Dec 20 2007
Fuji Electric Device Technology Co., Ltd.
Semiconductor device
D589012 ,
Mar 17 2008
Fuji Electric Device Technology Co., Ltd.
Semiconductor device
D597504 ,
Nov 30 2006
Kabushiki Kaisha Toshiba
Portion of a printed circuit board
D606951 ,
Nov 14 2008
Fuji Electric Device Technology Co, Ltd.
Semiconductor device
D653633 ,
Dec 14 2010
Fuji Electric Co., Ltd.
Semiconductor
D653634 ,
Oct 28 2010
Fuji Electric Co., Ltd.
Semiconductor
D689833 ,
May 19 2011
Fuji Electric Co., Ltd.
Semiconductor device
D693318 ,
Oct 27 2011
SUMITOMO ELECTRIC INDUSTRIES, LTD
Semiconductor module for power conversion
D699693 ,
Oct 03 2012
FUJI ELECTRIC CO , LTD
Semiconductor device
D703625 ,
Dec 06 2012
SAMSUNG ELECTRO-MECHANICS CO , LTD
Power semiconductor module
D704670 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
D704671 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
D705184 ,
Jul 11 2013
Fuji Electric Co., Ltd.
Semiconductor module
D710318 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
EM23056070001 ,
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a