Patent
   D724554
Priority
Feb 19 2014
Filed
May 22 2014
Issued
Mar 17 2015
Expiry
Mar 17 2029
Assg.orig
Entity
unknown
6
32
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front and right side perspective view of the semiconductor module of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals projects from the top surface. Each end in a longitudinal direction includes a mounting hole. Each corner includes a positioning boss.

Takahashi, Hideaki, Motohashi, Satoru, Terashima, Kenshi, Karasawa, Tatsuya

Patent Priority Assignee Title
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D827593, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 08 2014TAKAHASHI, HIDEAKIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329460882 pdf
May 09 2014MOTOHASHI, SATORUFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329460882 pdf
May 09 2014KARASAWA, TATSUYAFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329460882 pdf
May 09 2014TERASHIMA, KENSHIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329460882 pdf
May 22 2014Fuji Electric Co., Ltd.(assignment on the face of the patent)
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