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The ornamental design for a semiconductor element, as shown and described.
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FIG. 1 is a top, left, front perspective view of a semiconductor element showing our new design;
FIG. 2 is a bottom, left, front perspective view thereof;
FIG. 3 is a front elevational view thereof; and
FIG. 4 is a rear elevational view thereof.
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The portions in even broken lines are for illustrative purposes only and form no part of the claimed design. The portions in dot-dash broken lines define, but are not included in, the boundaries of the claimed design.
Oohata, Toyoharu, Iwafuchi, Toshiaki, Doi, Masato
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 17 2002 | Sony Corporation | (assignment on the face of the patent) | / | |||
Feb 22 2002 | IWAFUCHI, TOSHIAKI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012779 | /0601 | |
Feb 22 2002 | OOHATA, TOYOHARU | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012779 | /0601 | |
Feb 22 2002 | DOI, MSATO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012779 | /0601 |
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