Patent
   D485242
Priority
Jan 17 2002
Filed
Jan 17 2002
Issued
Jan 13 2004
Expiry
Jan 13 2018
Assg.orig
Entity
unknown
3
15
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a top, left, front perspective view of a semiconductor element showing our new design;

FIG. 2 is a bottom, left, front perspective view thereof;

FIG. 3 is a front elevational view thereof; and

FIG. 4 is a rear elevational view thereof.

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The portions in even broken lines are for illustrative purposes only and form no part of the claimed design. The portions in dot-dash broken lines define, but are not included in, the boundaries of the claimed design.

Oohata, Toyoharu, Iwafuchi, Toshiaki, Doi, Masato

Patent Priority Assignee Title
D505923, Nov 13 2003 Sony Corporation Semiconductor element
D505924, Nov 13 2003 Sony Corporation Semiconductor element
D724554, Feb 19 2014 Fuji Electric Co., Ltd. Semiconductor module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 17 2002Sony Corporation(assignment on the face of the patent)
Feb 22 2002IWAFUCHI, TOSHIAKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0127790601 pdf
Feb 22 2002OOHATA, TOYOHARUSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0127790601 pdf
Feb 22 2002DOI, MSATOSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0127790601 pdf
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