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The ornamental design for a semiconductor element, as shown and described.
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FIG. 1 is front perspective of a semiconductor element showing our new design, wherein the truncated hexagonal pyramid portion thereof is transparent;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof; and,
FIG. 6 is a top plan view thereof.
Portions in broken lines are for illustrative purposes only and form no part of claimed design.
Okuyama, Hiroyuki, Oohata, Toyoharu, Biwa, Goshi, Doi, Masato
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jun 06 2002 | OKUYAMA, HIROYUKI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013041 | /0690 | |
| Jun 06 2002 | DOI, MASATO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013041 | /0690 | |
| Jun 06 2002 | BIWA, GOSHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013041 | /0690 | |
| Jun 06 2002 | OOHATA, TOYOHARU | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013041 | /0690 | |
| Jun 25 2002 | Sony Corporation | (assignment on the face of the patent) | / |
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