Patent
   D396696
Priority
Jan 30 1997
Filed
Jan 30 1997
Issued
Aug 04 1998
Expiry
Aug 04 2012
Assg.orig
Entity
unknown
9
6
n/a
The ornamental design for a semiconductor package, as shown and described.

FIG. 1 is a perspective view of a semiconductor package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a perspective view of another embodiment of a semiconductor package showing our new design; and,

FIG. 9 is a front elevational view of the embodiment of FIG. 8. The rest of views of the embodiment of FIG. 8 are the same as those of the embodiment of FIG. 1.

Ueda, Kazuhiko, Takagi, Yuichi

Patent Priority Assignee Title
D420984, Mar 19 1997 Sony Corporation Lens for semiconductor element
D421743, Mar 19 1997 Sony Corporation Lens for semiconductor element
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D448738, Oct 04 2000 Sony Corporation Semiconductor element
D724554, Feb 19 2014 Fuji Electric Co., Ltd. Semiconductor module
D738834, Jul 29 2014 Driver circuit integrated LED module
D824866, Sep 30 2016 Rohm Co., Ltd. Semiconductor device
D914621, May 14 2019 Rohm Co., Ltd. Packaged semiconductor module
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
Patent Priority Assignee Title
4538168, Sep 30 1981 MICRO USPD, INC High power semiconductor package
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4681221, Oct 30 1986 International Business Machines Corporation Holder for plastic leaded chip carrier
5023703, Apr 30 1982 Fujitsu Limited Semiconductor device
5394009, Jul 30 1993 Sun Microsystems, Inc. Tab semiconductor package with cushioned land grid array outer lead bumps
5493153, Nov 26 1992 TOKYO TUNGSTEN CO , LTD Plastic-packaged semiconductor device having a heat sink matched with a plastic package
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 27 1997TAKAGI, YUICHISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0086550824 pdf
Jan 28 1997UEDA, KAZUHIKOSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0086550824 pdf
Jan 30 1997Sony Corporation(assignment on the face of the patent)
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