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The ornamental design for a semiconductor element, as shown and described. |
FIG. 1 is a top, front perspective view of a semiconductor element showing my new design;
FIG. 2 is a front elevational view thereof; and,
FIG. 3 is a rear elevational view thereof.
Portions in broken lines are for illustrative purposes only and form no part of claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 14 2000 | SEKIMOTO, EMIKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011209 | /0833 | |
Oct 04 2000 | Sony Corporation | (assignment on the face of the patent) | / |
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