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Patent
   D448738
Priority
Oct 04 2000
Filed
Oct 04 2000
Issued
Oct 02 2001
Expiry
Oct 02 2015
Inventors
Sekimoto, …
Assg.orig
Sony Corpo…
Assg.curr
Sony Corpo…
Entity
unknown
Referenced by
1
References
7
Maint.:
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a top, front perspective view of a semiconductor element showing my new design;

FIG. 2 is a front elevational view thereof; and,

FIG. 3 is a rear elevational view thereof.

Portions in broken lines are for illustrative purposes only and form no part of claimed design.
INVENTORS:

Sekimoto, Emiko

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
ER2702,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
D288557, Sep 10 1984 Semiconductor Components Industries, LLC Semiconductor housing
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D395423, Mar 13 1997 Sony Corporation Semiconductor package
D395638, Jan 30 1997 Sony Corporation Semiconductor package
D396696, Jan 30 1997 Sony Corporation Semiconductor package
D418485, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 14 2000SEKIMOTO, EMIKOSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0112090833 pdf
Oct 04 2000Sony Corporation(assignment on the face of the patent)
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