Patent
   D359028
Priority
Sep 02 1993
Filed
Sep 02 1993
Issued
Jun 06 1995
Expiry
Jun 06 2009

TERM.DISCL.
Assg.orig
Entity
unknown
51
7
n/a
The ornamental design for the socketed integrated circuit package, as shown and described.

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Siegel, Harry M., Kelappan, Krishnan, Hundt, Michael J.

Patent Priority Assignee Title
10256385, Oct 31 2007 CREELED, INC Light emitting die (LED) packages and related methods
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D394844, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
D396211, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396212, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396213, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D402273, Dec 26 1996 Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. Connector for printed circuit boards
D402274, Apr 01 1997 Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. Connector for printed circuit boards
D402638, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
D407383, Dec 11 1996 Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. Connector for printed circuit boards
D411512, Dec 11 1996 Sony Corporation; Solderless Terminal Mfg. Co., Ltd. Connector for printed circuit boards
D418485, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D432097, Nov 20 1999 Samsung Electronics Co., Ltd. Semiconductor package
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D448738, Oct 04 2000 Sony Corporation Semiconductor element
D507248, Jul 27 2004 Yamaichi Electronics Co., Ltd. Semiconductor carrier
D507545, Feb 20 2004 Yamaichi Electronics Co., Ltd. Semiconductor carrier
D516046, Feb 20 2004 Yamaichi Electronics Co. Base for a semiconductor carrier
D516528, Feb 20 2004 Yamaichi Electronics Co., Ltd. Cover for a semiconductor carrier
D518798, Jul 27 2004 Yamaichi Electronics Co., Ltd Cover for a semiconductor carrier
D525215, Jan 27 2004 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D594827, Dec 07 2006 CREE LED, INC Lamp package
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D738834, Jul 29 2014 Driver circuit integrated LED module
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D772182, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D777124, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D788722, Jul 17 2014 Advantest Corporation Socket for an electronic device testing apparatus
D819581, Jul 17 2014 Advantest Corporation Socket for electronic device testing apparatus
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D888673, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D902877, Jun 12 2018 Rohm Co., Ltd. Packaged semiconductor module
D903613, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D913978, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D934187, Jan 21 2020 GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
ER1981,
ER2039,
Patent Priority Assignee Title
3762039,
3891898,
4422703, Sep 15 1981 Thomas & Betts Corporation Electrical connector for use with multi-pin arrays
4868349, May 09 1988 National Semiconductor Corporation Plastic molded pin-grid-array power package
5119269, Aug 23 1989 SEIKO EPSON CORPORATION, A CORP OF JAPAN Semiconductor with a battery unit
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
82797,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 02 1993SGS-Thomson Microelectronics, Inc.(assignment on the face of the patent)
Sep 02 1993SIEGEL, HARRY M SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068200844 pdf
Sep 02 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068200844 pdf
Dec 01 1993SIEGEL, HARRY MICHAELSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900298 pdf
Dec 01 1993HUNDT, MICHAEL J SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900298 pdf
Dec 01 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900298 pdf
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