Patent
   D864135
Priority
Oct 26 2017
Filed
Mar 26 2019
Issued
Oct 22 2019
Expiry
Oct 22 2034
Assg.orig
Entity
unknown
15
54
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Mori, Shigeru, Yokoyama, Shuhei, Hasegawa, Maki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2018YOKOYAMA, SHUHEIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486980696 pdf
Mar 29 2018HASEGAWA, MAKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486980696 pdf
Mar 29 2018MORI, SHIGERUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486980696 pdf
Mar 26 2019Mitsubishi Electric Corporation(assignment on the face of the patent)
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