|
The ornamental design for a semiconductor device, as shown. |
FIG. 1 is a perspective view of the top, front and left side of a semiconductor device showing our new design;
FIG. 2 is a perspective view of the bottom, rear and right side thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a bottom plan view thereof.
Nakayama, Masao, Tara, Katsuji, Muramatsu, Kaoru
Patent | Priority | Assignee | Title |
10256385, | Oct 31 2007 | CREELED, INC | Light emitting die (LED) packages and related methods |
6501362, | Nov 28 2000 | UMEC USA, Inc. | Ferrite core |
8975694, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
9269661, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
D416872, | Nov 06 1997 | ZF MICRO SOLUTIONS, INC | Single component computer |
D432097, | Nov 20 1999 | Samsung Electronics Co., Ltd. | Semiconductor package |
D444132, | Aug 23 2000 | Kabushiki Kaisha Toshiba | Semiconductor element |
D466873, | Oct 31 2001 | Siliconix Incorporated | Semiconductor chip package |
D472528, | Oct 31 2001 | Siliconix Incorporated | Semiconductor chip package |
D476959, | Jul 31 2002 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D504874, | Aug 11 2004 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Semiconductor device package |
D510728, | Aug 11 2004 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Semiconductor device package |
D522978, | Jun 25 2004 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Information storage semiconductor element |
D525214, | Jun 25 2004 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Information storage semiconductor element |
D594827, | Dec 07 2006 | CREE LED, INC | Lamp package |
D648290, | Jun 08 2010 | Miyoshi Electronics Corporation | Semiconductor device |
D694724, | Oct 03 2012 | HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD | Semiconductor device |
D699693, | Oct 03 2012 | FUJI ELECTRIC CO , LTD | Semiconductor device |
D714745, | Feb 14 2012 | Panasonic Corporation | Semiconductor |
D717253, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717254, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717255, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717256, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719113, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719926, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D721047, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
D732487, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D732488, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D738834, | Jul 29 2014 | Driver circuit integrated LED module | |
D752000, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D758329, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D769834, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D796459, | Apr 11 2016 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
D822629, | Jan 26 2017 | Kyocera Corporation | Semiconductor package |
D824866, | Sep 30 2016 | Rohm Co., Ltd. | Semiconductor device |
D832227, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
D832228, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
D839244, | Apr 29 2016 | TE Connectivity Solutions GmbH | Antenna housing |
D845921, | May 02 2017 | Rohm Co., Ltd. | Semiconductor device |
D852765, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D853343, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D859334, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D864135, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D902877, | Jun 12 2018 | Rohm Co., Ltd. | Packaged semiconductor module |
D914621, | May 14 2019 | Rohm Co., Ltd. | Packaged semiconductor module |
D920264, | Nov 27 2019 | The Noco Company | Semiconductor device |
D922970, | Oct 28 2019 | Rohm Co., Ltd. | Semiconductor device |
D928105, | Oct 28 2019 | Rohm Co., Ltd. | Semiconductor device |
D932452, | Nov 27 2019 | The Noco Company | Semiconductor device |
D934187, | Jan 21 2020 | GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD | Integrated circuit package |
D937231, | Apr 06 2020 | WOLFSPEED, INC | Power semiconductor package |
D945384, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Semiconductor module |
D969762, | Apr 06 2020 | WOLFSPEED, INC. | Power semiconductor package |
D971863, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D972516, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D981356, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
ER266, |
Patent | Priority | Assignee | Title |
5347160, | Sep 28 1992 | Sundstrand Corporation | Power semiconductor integrated circuit package |
206327, | |||
D260091, | Aug 25 1978 | Hitachi, Ltd. | Semiconductor |
D288557, | Sep 10 1984 | Semiconductor Components Industries, LLC | Semiconductor housing |
D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
D358805, | Sep 24 1993 | SGS-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 01 1997 | NAKAYAMA, MASAO | Matsushita Electronics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008529 | /0060 | |
Apr 01 1997 | MURAMATSU, KAORU | Matsushita Electronics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008529 | /0060 | |
Apr 01 1997 | TARA, KATSUJI | Matsushita Electronics Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008529 | /0060 | |
Apr 16 1997 | Matsushita Electronics Corporation | (assignment on the face of the patent) | / | |||
Apr 04 2001 | Matsushita Electronics Corporation | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | MERGER SEE DOCUMENT FOR DETAILS | 021994 | /0678 | |
Oct 01 2008 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | Panasonic Corporation | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021994 | /0755 |
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