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Patent
   D416872
Priority
Nov 06 1997
Filed
Nov 06 1997
Issued
Nov 23 1999
Expiry
Nov 23 2013
Inventors
Burke, Jon…
Assg.orig
ZF MICROSY…
Assg.curr
ZF MICRO S…
Entity
unknown
Referenced by
15
References
17
Maint.:
n/a
The ornamental design for a single component computer, as described and claimed.

FIG. 1 is a perspective view of a single component computer embodying my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a side elevational view thereof, the other side being identical;

FIG. 4 is a front elevational view thereof, the rear view being identical; and,

FIG. 5 is a bottom plan view thereof.
INVENTORS:

Burke, Jonathan Christopher

THIS PATENT IS REFERENCED BY THESE PATENTS:
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D459316, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459317, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D460744, Feb 15 2001 Mitsubishi Denki Kabushiki Kaishi Semiconductor device
D460951, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D461171, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D465773, Aug 31 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D473199, Nov 30 2001 Kabushiki Kaisha Toshiba Portion of semiconductor device
D480371, Nov 30 2001 Kabushiki Kaisha Toshiba Semiconductor device
D658601, Jun 15 2010 Toshiba Lighting & Technology Corporation Light emitting diode module
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D906989, Aug 16 2017 FLUENCE BIOENGINEERING, INC Heat sink for a luminaire
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D927438, Sep 09 2019 Thales Alenia Space France Housing for electronic modules
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
4506938, Jul 06 1982 AT&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
5206792, Nov 04 1991 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
5346402, Mar 09 1992 Matsushita Electric Industrial Co., Ltd. Electronic circuit device and manufacturing method thereof
5422790, Feb 18 1994 Computer chip mounting hardware for heat dissipation
5513073, Apr 28 1994 JDS Uniphase Corporation Optical device heat spreader and thermal isolation apparatus
5574627, Jul 24 1995 B E AEROSPACE, INC Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
5640305, Jun 07 1995 ANTARES CAPITAL LP, AS SUCCESSOR AGENT Anchor for securing a heat sink to a printed circuit board
5743748, Apr 04 1995 Mitsubishi Electric Semiconductor Software Co., Ltd.; Mitsubishi Denki Kabushiki Kaisha Emulator probe
5844307, Jul 31 1995 NEC Corporation Plastic molded IC package with leads having small flatness fluctuation
D260091, Aug 25 1978 Hitachi, Ltd. Semiconductor
D260986, Aug 25 1978 Hitachi, Ltd. Semiconductor
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
D318271, Jul 04 1987 IBIDEN CO , LTD Substrate for mounting semiconductors
D396212, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396213, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D402274, Apr 01 1997 Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. Connector for printed circuit boards
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 17 1997BURKE, JONATHAN CHRISTOPHERZF MICROSYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0089310053 pdf
Nov 06 1997ZF Microsystems, Inc.(assignment on the face of the patent)
Jul 29 1999ZF MICROSYSTEMS, INC ZF EMBEDDED, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0103270561 pdf
Feb 11 2000ZF EMBEDDED, INC ZF LINUX DEVICES, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0108140214 pdf
Mar 02 2001ZF LINUX DEVICES, INC ZF MICRO DEVICES, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0117510896 pdf
Dec 06 2002ZF MICRO DEVICES, INC ZF MICRO SOLUTIONS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0136630649 pdf
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