Patent
   D318271
Priority
Jul 04 1987
Filed
Jan 04 1988
Issued
Jul 16 1991
Expiry
Jul 16 2005
Assg.orig
Entity
unknown
10
19
n/a
The ornamental design for a substrate for mounting semiconductors, as shown.

FIG. 1 is a top perspective view of a substrate for mounting semi-conductors showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a front elevational view thereof.

Hasegawa, Terutomi, Goto, Nobumichi

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D416872, Nov 06 1997 ZF MICRO SOLUTIONS, INC Single component computer
D443253, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Transistor substrate
D566060, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577691, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577692, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
Patent Priority Assignee Title
4288441, Jul 30 1980 Daiichi Seiyaku Co., Ltd. Nicotinoyl pantetheine derivatives
4338621, Feb 04 1980 SAMSUNG ELECTRONICS CO , LTD Hermetic integrated circuit package for high density high power applications
4437141, Sep 14 1981 Texas Instruments Incorporated High terminal count integrated circuit device package
4458291, Jul 22 1981 Fujitsu Limited Package for enclosing semiconductor elements
4513355, Jun 15 1983 Motorola, Inc. Metallization and bonding means and method for VLSI packages
4677526, Mar 01 1984 Thomas & Betts International, Inc Plastic pin grid array chip carrier
4698663, Sep 17 1986 Fujitsu Limited Heatsink package for flip-chip IC
EP232837,
JP35653,
JP48945,
JP150353,
JP271863,
JP644662,
JP647072,
JP647074,
JP647078,
JP673983,
JP6739831,
JP673984,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 22 1992HASEGAWA, TERUTOMIIBIDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0063640935 pdf
Apr 22 1992GOTO, NOBUMICHIIBIDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0063640935 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule