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The ornamental design for a substrate for mounting semiconductors, as shown. |
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FIG. 1 is a top perspective view of a substrate for mounting semi-conductors showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
Hasegawa, Terutomi, Goto, Nobumichi
| Patent | Priority | Assignee | Title |
| 9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
| D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
| D416872, | Nov 06 1997 | ZF MICRO SOLUTIONS, INC | Single component computer |
| D443253, | Jul 14 1999 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Transistor substrate |
| D566060, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| D577691, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| D577692, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| D719537, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
| D769834, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| Patent | Priority | Assignee | Title |
| 4288441, | Jul 30 1980 | Daiichi Seiyaku Co., Ltd. | Nicotinoyl pantetheine derivatives |
| 4338621, | Feb 04 1980 | SAMSUNG ELECTRONICS CO , LTD | Hermetic integrated circuit package for high density high power applications |
| 4437141, | Sep 14 1981 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| 4458291, | Jul 22 1981 | Fujitsu Limited | Package for enclosing semiconductor elements |
| 4513355, | Jun 15 1983 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| 4677526, | Mar 01 1984 | Thomas & Betts International, Inc | Plastic pin grid array chip carrier |
| 4698663, | Sep 17 1986 | Fujitsu Limited | Heatsink package for flip-chip IC |
| EP232837, | |||
| JP35653, | |||
| JP48945, | |||
| JP150353, | |||
| JP271863, | |||
| JP644662, | |||
| JP647072, | |||
| JP647074, | |||
| JP647078, | |||
| JP673983, | |||
| JP6739831, | |||
| JP673984, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 22 1992 | HASEGAWA, TERUTOMI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006364 | /0935 | |
| Apr 22 1992 | GOTO, NOBUMICHI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006364 | /0935 |
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