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Patent
D577691
Priority
Apr 13 2005
Filed
Feb 19 2008
Issued
Sep 30 2008
Expiry
Sep 30 2022
Assg.orig
Entity
unknown
10
12
n/a
The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot-dash line in FIG. 1 ; and,
FIG. 3 shows an enlarged sectional view along the line III—III in FIG. 2 .
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.
Ohsawa, Tetsuya , Tani, Emiko
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Patent
Priority
Assignee
Title
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AVAGO TECHNOLOGIES ECBU IP SINGAPORE PTE LTD
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MACOM CONNECTIVITY SOLUTIONS, LLC
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International Business Machines Corporation
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PACE, INCORPORATED, A CORP OF MARYLAND
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UNION BANK, 942 PACIFIC AVENUE, TACOMA, WASHINGTON 98401, A WA CORP ; DETECTS INC , 100 COMMERCE AVENUE S W , GRAND RAPIDS, MICHIGAN 49503, A MI CORP
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IBIDEN CO , LTD
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Matsushita Electric Industrial Co., Ltd.
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AMERICAN EXPRESS TRAVEL RELATED SERVICES CO , INC
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Executed on Assignor Assignee Conveyance Frame Reel Doc
Feb 19 2008 Nitto Denko Corporation (assignment on the face of the patent) /
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