Patent
   D577691
Priority
Apr 13 2005
Filed
Feb 19 2008
Issued
Sep 30 2008
Expiry
Sep 30 2022
Assg.orig
Entity
unknown
10
12
n/a
The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line III—III in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.

Ohsawa, Tetsuya, Tani, Emiko

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 19 2008Nitto Denko Corporation(assignment on the face of the patent)
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