FIG. 1 is a perspective view of a first embodiment of a wave circuit pattern showing my new design;
FIG. 2 is a front elevation view thereof, the back elevation view being identical;
FIG. 3 is a side view thereof, the opposite side view is a mirror image;
FIG. 4 is a perspective view of a second embodiment of a wave circuit pattern showing my new design;
FIG. 5 is a front elevation view thereof, the back elevation view being identical;
FIG. 6 is a side view thereof, the opposite side view is a mirror image;
FIG. 7 is a perspective view of a third embodiment of a wave circuit pattern showing my new design;
FIG. 8 is a front elevation view thereof, the back elevation view being identical;
FIG. 9 is a side view thereof, the opposite side view is a mirror image;
FIG. 10 is a perspective view of a fourth embodiment of a wave circuit pattern showing my new design;
FIG. 11 is a front elevation view thereof, the back elevation view being identical; and,
FIG. 12 is a side view thereof, the opposite side view is a mirror image.
The broken lines in FIGS. 1,2,4,5,7,8,10 and 11 adjacent to the solid wave circuit pattern show a repeating pattern that forms no part of the claimed design. All other broken lines are directed to environmental structure and form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
6163042, |
Jul 02 1998 |
Oki Electric Industry Co., Ltd. |
Semiconductor integrated circuit |
20040192082, |
|
|
|
20040238819, |
|
|
|
20050280157, |
|
|
|
20070205017, |
|
|
|
20080080151, |
|
|
|
20080257589, |
|
|
|
20080285241, |
|
|
|
D254687, |
Jan 25 1979 |
McDonnell Douglas Corporation |
Biochemical card for use with an automated microbial identification machine |
D319045, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semi-conductor substrate with conducting pattern |
D319629, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semiconductor substrate with conducting pattern |
D319814, |
Apr 13 1988 |
IBIDEN CO , LTD |
Semi-conductor substrate with conducting pattern |
D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
D474773, |
Jul 10 2001 |
Sony Corporation |
Information recording element |
D485536, |
Mar 10 2003 |
PULSE ELECTRONICS, INC |
Electronics component assembly |
D543160, |
May 17 2004 |
Hoya Corporation |
Photomask blank |
D566060, |
Apr 13 2005 |
Nitto Denko Corporation |
Grooves formed around a semiconductor device on a circuit board |
D577691, |
Apr 13 2005 |
Nitto Denko Corporation |
Grooves formed around a semiconductor device on a circuit board |
D601520, |
Jan 14 2005 |
Panasonic Corporation |
Electric circuit board |
D605613, |
May 15 2008 |
CommScope EMEA Limited; CommScope Technologies LLC |
Printed circuit board for electrical connector |
D612347, |
Jan 14 2005 |
Panasonic Corporation |
Electric circuit board |
D613690, |
Dec 09 2008 |
FUJIFILM Corporation |
Conductive sheet |
D615506, |
Jun 23 2009 |
DBG Group Investments, LLC |
Integrated energy management system |
D615927, |
May 09 2008 |
FUJIFILM Corporation |
Conductive sheet |
D639756, |
Jul 16 2010 |
DBG Group Investments, LLC |
Circuit board for integrated ozone laundry system |
JP2009259929, |
|
|
|
WO2010086034, |
|
|
|
WO2010086416, |
|
|
|
WO2010146524, |
|
|
|