Patent
   D764423
Priority
Mar 05 2014
Filed
Mar 05 2014
Issued
Aug 23 2016
Expiry
Aug 23 2030
Assg.orig
Entity
unknown
7
16
n/a
The ornamental design for a corrugated elements for defining longitudinal channels in a boat for a deposition apparatus, as shown and described.

FIG. 1 is a perspective view of a corrugated elements for defining longitudinal channels in a boat for a deposition apparatus, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a cross sectional view thereof taken along line 3-3 in FIG. 1; and,

FIG. 4 is a bottom plan view thereof.

The dashed-dot-dashed lines define the boundary of the claimed design. The even dashed lines represent unclaimed subject matter and form no part of the claimed design. All surfaces not shown form no part of the claimed design.

Dempster, James, Maynard, Jason

Patent Priority Assignee Title
10677538, Jan 05 2018 Baltimore Aircoil Company Indirect heat exchanger
D788723, Mar 04 2015 ABL IP Holding LLC Serrated light engine and circuit board
D833405, Mar 04 2015 ABL IP Holding LLC Serrated light engine and circuit board
D871357, Mar 04 2015 ABL IP Holding LLC Serrated light engine and circuit board
D876373, Mar 04 2015 ABL IP Holding LLC Serrated light engine and circuit board
D876374, Mar 04 2015 ABL IP Holding LLC Serrated light engine and circuit board
D889420, Jan 05 2018 Baltimore Aircoil Company, Inc. Heat exchanger cassette
Patent Priority Assignee Title
4303694, May 04 1979 Method and device of deposition through vacuum evaporation making use _of a modulated electron beam and a screen
5448511, Jun 01 1994 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
5904958, Mar 20 1998 REXAM IMAGE PRODUCTS INC Adjustable nozzle for evaporation or organic monomers
20040192082,
20040238819,
20100081104,
D254687, Jan 25 1979 McDonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
D589471, Sep 28 2006 Tokyo Electron Limited Heater for manufacturing semiconductor
D601521, Sep 28 2006 Tokyo Electron Limited Heater for manufacturing semiconductor
D613690, Dec 09 2008 FUJIFILM Corporation Conductive sheet
D614153, Oct 10 2007 ASM IP HOLDING B V Reactant source vessel
D615927, May 09 2008 FUJIFILM Corporation Conductive sheet
D616394, Mar 06 2009 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
D701182, Apr 12 2011 Plasyl Limited Wave circuit pattern
D737785, Jul 29 2013 KOKUSAI ELECTRIC CORPORATION Boat for substrate processing apparatus
D738329, Jul 29 2013 KOKUSAI ELECTRIC CORPORATION Boat for substrate processing apparatus
/////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 23 2013HZO, INC PACIFIC WESTERN BANK AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0384350224 pdf
Mar 05 2014HZO, Inc.(assignment on the face of the patent)
Mar 18 2014DEMPSTER, JAMESHZO, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0324660102 pdf
Mar 18 2014MAYNARD, JASONHZO, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0324660102 pdf
Dec 27 2017HZO, INC CATHAY BANKSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0449950270 pdf
Dec 29 2017Pacific Western BankHZO, INC RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0445230446 pdf
Feb 04 2019HZO, INC CATHAY BANKSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0482840626 pdf
Jun 05 2023HZO, INC CATHAY BANKSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0638610025 pdf
Jun 05 2023HZO HONG KONG LIMITEDCATHAY BANKSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0638610025 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule