Electronics component assembly

Abstract

Description

FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a side elevation view of a second embodiment of an electronics component package, showing our new design;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a front elevation view thereof.

The broken lines depict environmental structure and form no part of the claimed design.

Claims

The ornamental design of an electronics component assembly, as shown and described.