Patent
   D798249
Priority
Oct 17 2013
Filed
Mar 02 2016
Issued
Sep 26 2017
Expiry
Sep 26 2032
Assg.orig
Entity
unknown
4
42
n/a
The ornamental design for an electric terminal, as shown and described.

FIG. 1 is a top, front, right perspective view of an electric terminal showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The ornamental design which is claimed is shown in the figures.

The dashed-dot-dashed lines represent the boundary line of the claimed design. The even dashed broken lines shown in the drawings represent portions of the electric terminal that form no part of the claimed design.

The claimed design should be understood to include the outer solid line edges of the protruding members shown in FIGS. 1-5, as well as the bottom surface area in FIG. 7.

Vinciarelli, Patrizio, LaFleur, Michael B.

Patent Priority Assignee Title
D814431, May 15 2015 Mitsubishi Electric Corporation Power semiconductor device
D834548, Oct 17 2013 Vicor Corporation Electric terminal
D877708, Oct 17 2013 Vicor Corporation Electrical terminal
D942406, Oct 17 2013 Vicor Corporation Electric terminal
Patent Priority Assignee Title
3579046,
4338621, Feb 04 1980 SAMSUNG ELECTRONICS CO , LTD Hermetic integrated circuit package for high density high power applications
4698663, Sep 17 1986 Fujitsu Limited Heatsink package for flip-chip IC
5066999, Oct 23 1989 MICRON SEMICONDUCTOR, INC Resistor under wirebond pad
5742005, Sep 14 1994 Sumitomo Wiring Systems, Ltd. Electrical connection box
5757082, Jul 31 1995 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
5994772, Dec 19 1996 LG Semicon Co., Ltd. Semiconductor package
6078505, May 14 1999 TriQuint Semiconductor, Inc Circuit board assembly method
6348742, Jan 25 1999 Clear Logic, Inc. Sacrificial bond pads for laser configured integrated circuits
6476505, Apr 27 1999 LAPIS SEMICONDUCTOR CO , LTD Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners
6483038, May 23 2000 SAMSUNG ELECTRONICS CO , LTD Memory card
6537850, Mar 16 2001 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
6753482, May 06 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor component with adjustment circuitry
7709292, Sep 29 2006 Innovate, LLC Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
20060097374,
20090004776,
20140070381,
20140099805,
20140106621,
D317300, Jul 04 1987 IBIDEN CO , LTD Semi-conductor mounting substrate
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D485536, Mar 10 2003 PULSE ELECTRONICS, INC Electronics component assembly
D540272, Apr 18 2005 Murata Manufacturing Co., Ltd. Semiconductor module
D547371, Oct 22 2005 C3KB SOLUTIONS, INC Reminder form
D601520, Jan 14 2005 Panasonic Corporation Electric circuit board
D612347, Jan 14 2005 Panasonic Corporation Electric circuit board
D633054, Jul 28 2009 PANASONIC ELECTRIC WORKS CO , LTD Electro luminescence module
D633450, Jul 28 2009 PANASONIC ELECTRIC WORKS CO , LTD Electro luminescence module
D638809, May 14 2010 Panasonic Corporation Substrate for light source of light emitting diode
D638810, May 14 2010 Panasonic Corporation Substrate for light source of light emitting diode
D684547, Aug 30 2011 Panasonic Corporation Fixing base for an electroluminescence module
D690277, Sep 07 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D690672, Oct 04 2011 Kabushiki Kaisha Yaskawa Denki Encoder optical module
D694200, Sep 07 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D699201, Oct 01 2012 TELIT CINTERION DEUTSCHLAND GMBH Pad arrangement of a circuit module
D708594, Jan 11 2013 Panasonic Corporation Panel board for electroluminescence module
D708595, Jan 11 2013 Panasonic Corporation Electroluminescence module
D730304, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D736213, Jul 01 2014 Samsung Electronics Co., Ltd. Memory card
D736216, Jul 30 2014 Samsung Electronics Co., Ltd. Memory card
D754083, Oct 17 2013 Vicor Corporation Electric terminal
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 15 2013LAFLEUR, MICHAEL B VLT, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0535060181 pdf
Oct 15 2013VINCIARELLI, PATRIZIOVLT, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0535060181 pdf
Mar 02 2016VLT, Inc.(assignment on the face of the patent)
Jul 27 2020VLT, INC Vicor CorporationMERGER SEE DOCUMENT FOR DETAILS 0536600992 pdf
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