FIG. 1 is a top, front, right perspective view of an electric terminal showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The ornamental design which is claimed is shown in the figures.
The dashed-dot-dashed lines represent the boundary line of the claimed design. The even dashed broken lines shown in the drawings represent portions of the electric terminal that form no part of the claimed design.
The claimed design should be understood to include the outer solid line edges of the protruding members shown in FIGS. 1-5, as well as the bottom surface area in FIG. 7.
Patent |
Priority |
Assignee |
Title |
3579046, |
|
|
|
4338621, |
Feb 04 1980 |
SAMSUNG ELECTRONICS CO , LTD |
Hermetic integrated circuit package for high density high power applications |
4698663, |
Sep 17 1986 |
Fujitsu Limited |
Heatsink package for flip-chip IC |
5066999, |
Oct 23 1989 |
MICRON SEMICONDUCTOR, INC |
Resistor under wirebond pad |
5742005, |
Sep 14 1994 |
Sumitomo Wiring Systems, Ltd. |
Electrical connection box |
5757082, |
Jul 31 1995 |
Rohm Co., Ltd. |
Semiconductor chips, devices incorporating same and method of making same |
5994772, |
Dec 19 1996 |
LG Semicon Co., Ltd. |
Semiconductor package |
6078505, |
May 14 1999 |
TriQuint Semiconductor, Inc |
Circuit board assembly method |
6348742, |
Jan 25 1999 |
Clear Logic, Inc. |
Sacrificial bond pads for laser configured integrated circuits |
6476505, |
Apr 27 1999 |
LAPIS SEMICONDUCTOR CO , LTD |
Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
6483038, |
May 23 2000 |
SAMSUNG ELECTRONICS CO , LTD |
Memory card |
6537850, |
Mar 16 2001 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method for fabricating semiconductor components with terminal contacts having alternate electrical paths |
6753482, |
May 06 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Semiconductor component with adjustment circuitry |
7709292, |
Sep 29 2006 |
Innovate, LLC |
Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
20060097374, |
|
|
|
20090004776, |
|
|
|
20140070381, |
|
|
|
20140099805, |
|
|
|
20140106621, |
|
|
|
D317300, |
Jul 04 1987 |
IBIDEN CO , LTD |
Semi-conductor mounting substrate |
D466093, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD |
Hybird integrated circuit board |
D471167, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit board |
D485536, |
Mar 10 2003 |
PULSE ELECTRONICS, INC |
Electronics component assembly |
D540272, |
Apr 18 2005 |
Murata Manufacturing Co., Ltd. |
Semiconductor module |
D547371, |
Oct 22 2005 |
C3KB SOLUTIONS, INC |
Reminder form |
D601520, |
Jan 14 2005 |
Panasonic Corporation |
Electric circuit board |
D612347, |
Jan 14 2005 |
Panasonic Corporation |
Electric circuit board |
D633054, |
Jul 28 2009 |
PANASONIC ELECTRIC WORKS CO , LTD |
Electro luminescence module |
D633450, |
Jul 28 2009 |
PANASONIC ELECTRIC WORKS CO , LTD |
Electro luminescence module |
D638809, |
May 14 2010 |
Panasonic Corporation |
Substrate for light source of light emitting diode |
D638810, |
May 14 2010 |
Panasonic Corporation |
Substrate for light source of light emitting diode |
D684547, |
Aug 30 2011 |
Panasonic Corporation |
Fixing base for an electroluminescence module |
D690277, |
Sep 07 2011 |
SAMSUNG DISPLAY CO , LTD |
Electroluminescence module |
D690672, |
Oct 04 2011 |
Kabushiki Kaisha Yaskawa Denki |
Encoder optical module |
D694200, |
Sep 07 2011 |
SAMSUNG DISPLAY CO , LTD |
Electroluminescence module |
D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
D708594, |
Jan 11 2013 |
Panasonic Corporation |
Panel board for electroluminescence module |
D708595, |
Jan 11 2013 |
Panasonic Corporation |
Electroluminescence module |
D730304, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
D736213, |
Jul 01 2014 |
Samsung Electronics Co., Ltd. |
Memory card |
D736216, |
Jul 30 2014 |
Samsung Electronics Co., Ltd. |
Memory card |
D754083, |
Oct 17 2013 |
Vicor Corporation |
Electric terminal |