|
The ornamental design for a semiconductor module, as shown and described.
|
FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.
Patent | Priority | Assignee | Title |
11333677, | Jul 23 2018 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using heuristic models |
11662698, | Jul 23 2018 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
11747775, | Jul 23 2018 | CACI, Inc.—Federal | Integrated tamper detection system and methods |
D690672, | Oct 04 2011 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
D699201, | Oct 01 2012 | TELIT CINTERION DEUTSCHLAND GMBH | Pad arrangement of a circuit module |
D743356, | Jun 17 2011 | KORRUS, INC | Diamond-shaped semiconductor die |
D754083, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D761745, | Jun 28 2013 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
D768115, | Feb 05 2015 | RF Digital Corporation | Module |
D775092, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D775093, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D784937, | Nov 13 2014 | Tokyo Electron Limited | Dummy wafer |
D785576, | Nov 13 2014 | Tokyo Electron Limited | Dummy wafer |
D786810, | Nov 13 2014 | Tokyo Electron Limited | Dummy wafer |
D798249, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D813182, | Aug 02 2016 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D830348, | Sep 26 2013 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
D834548, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D846513, | Apr 27 2016 | NGK Insulators, Ltd. | Sheet heater for electrostatic chuck |
D872032, | Sep 14 2018 | TELIT COMMUNICATIONS S P A | Connection module |
D872033, | Sep 14 2018 | TELIT COMMUNICATIONS S P A | Connection module |
D877708, | Oct 17 2013 | Vicor Corporation | Electrical terminal |
D892774, | Sep 26 2013 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
D904325, | Mar 20 2019 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
D904355, | Dec 11 2015 | TELIT CINTERION DEUTSCHLAND GMBH | Radio module |
D934821, | Jul 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D942406, | Oct 17 2013 | Vicor Corporation | Electric terminal |
D942974, | Nov 20 2018 | THALES DIS AIS DEUTSCHLAND GMBH | Cellular module |
D947800, | Jul 16 2019 | CACI, Inc.—Federal | Integrated module |
D951212, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951213, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951214, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951215, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D988300, | Mar 09 2021 | IoT module | |
ER1930, | |||
ER3835, | |||
ER4359, | |||
ER5833, |
Patent | Priority | Assignee | Title |
5994772, | Dec 19 1996 | LG Semicon Co., Ltd. | Semiconductor package |
6127729, | Jun 29 1998 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection |
6373447, | Dec 28 1998 | KAWASAKI MICROELECTRONICS, INC | On-chip antenna, and systems utilizing same |
6781239, | Dec 05 2001 | National Semiconductor Corporation | Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip |
6836002, | Mar 09 2000 | III Holdings 10, LLC | Semiconductor device |
6992395, | Jul 04 2001 | Sony Corporation | Semiconductor device and semiconductor module having external electrodes on an outer periphery |
20060043544, | |||
20060097374, | |||
20060131715, | |||
D318461, | Apr 13 1988 | IBIDEN CO , LTD , A JAPANESE CORP | Semi-conductor mounting substrate |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 25 2005 | HIGASHIBATA, KAZUAKI | MURATA MANUFACTURING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017018 | /0965 | |
Sep 22 2005 | Murata Manufacturing Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |