Patent
   D540272
Priority
Apr 18 2005
Filed
Sep 22 2005
Issued
Apr 10 2007
Expiry
Apr 10 2021

TERM.DISCL.
Assg.orig
Entity
unknown
34
10
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.

Higashibata, Kazuaki

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Jul 25 2005HIGASHIBATA, KAZUAKIMURATA MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0170180965 pdf
Sep 22 2005Murata Manufacturing Co., Ltd.(assignment on the face of the patent)
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