FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
| Patent |
Priority |
Assignee |
Title |
| 1998526, |
|
|
|
| 273559, |
|
|
|
| 295023, |
|
|
|
| 5370398, |
Jun 30 1993 |
|
Close and open game |
| 5757082, |
Jul 31 1995 |
Rohm Co., Ltd. |
Semiconductor chips, devices incorporating same and method of making same |
| 5994772, |
Dec 19 1996 |
LG Semicon Co., Ltd. |
Semiconductor package |
| 6307269, |
Jul 11 1997 |
LONGITUDE SEMICONDUCTOR S A R L |
Semiconductor device with chip size package |
| 6753482, |
May 06 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Semiconductor component with adjustment circuitry |
| 6836002, |
Mar 09 2000 |
III Holdings 10, LLC |
Semiconductor device |
| 729489, |
|
|
|
| 8618540, |
Jun 08 2010 |
Samsung Electronics Co., Ltd. |
Semiconductor packages |
| D318461, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semi-conductor mounting substrate |
| D319045, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semi-conductor substrate with conducting pattern |
| D319629, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semiconductor substrate with conducting pattern |
| D319814, |
Apr 13 1988 |
IBIDEN CO , LTD |
Semi-conductor substrate with conducting pattern |
| D427159, |
Jun 27 1997 |
Sony Corporation |
Semiconductor element |
| D456367, |
Dec 15 2000 |
Protek Devices, LP |
Semiconductor chip |
| D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
| D466093, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD |
Hybird integrated circuit board |
| D471167, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit board |
| D487430, |
Jul 10 2002 |
Matsushita Electric Industrial Co., Ltd. |
Semiconductor memory element |
| D504874, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
| D510728, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
| D540272, |
Apr 18 2005 |
Murata Manufacturing Co., Ltd. |
Semiconductor module |
| D598380, |
May 09 2008 |
FUJIFILM Corporation |
Conductive sheet |
| D648290, |
Jun 08 2010 |
Miyoshi Electronics Corporation |
Semiconductor device |
| D687898, |
Jun 11 2012 |
|
Set of pai-gow tiles |
| D691101, |
Nov 08 2011 |
Seiko Epson Corporation |
Circuit board for an ink cartridge |
| D721047, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
| D752000, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
| D754083, |
Oct 17 2013 |
Vicor Corporation |
Electric terminal |
| D768115, |
Feb 05 2015 |
RF Digital Corporation |
Module |
| D775093, |
Oct 17 2013 |
Vicor Corporation |
Electric terminal |
| D789456, |
Feb 12 2015 |
|
Set of square domino tiles |
| D813182, |
Aug 02 2016 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Semiconductor device |
| D864882, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D864883, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D865690, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D904325, |
Mar 20 2019 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
| JP1581768, |
|
|
|
| JP1588125, |
|
|
|
| JP1588481, |
|
|
|
| JP1632160, |
|
|
|
| JP1632597, |
|
|
|
| JP1640664, |
|
|
|
| JP1641048, |
|
|
|
| JP1641049, |
|
|
|
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