FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a rear elevation view thereof;
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
4152714, |
Jan 16 1978 |
SAMSUNG ELECTRONICS CO , LTD |
Semiconductor apparatus |
4809135, |
Aug 04 1986 |
Intersil Corporation |
Chip carrier and method of fabrication |
4891686, |
Apr 08 1988 |
Directed Energy, Inc.; DIRECTED ENERGY, INC |
Semiconductor packaging with ground plane conductor arrangement |
4949158, |
Jul 24 1987 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
5105257, |
Aug 08 1990 |
Mitsubishi Denki Kabushiki Kaisha |
Packaged semiconductor device and semiconductor device packaging element |
5187552, |
Mar 28 1979 |
|
Shielded field-effect transistor devices |
5401910, |
Dec 03 1992 |
Murata Manufacturing Co. Ltd. |
Electronic component |
5585670, |
Sep 05 1995 |
Mitsubishi Electric Semiconductor Software Co.; Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device package |
5844307, |
Jul 31 1995 |
NEC Corporation |
Plastic molded IC package with leads having small flatness fluctuation |
6166430, |
May 27 1998 |
MICRO-OPTIMUS TECHNOLOGIES, INC |
Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device |
6238953, |
Jan 12 1999 |
Sony Corporation |
Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
6353258, |
Jan 17 1995 |
Hitachi, Ltd.; Hitachi Car Engineering Co., Ltd. |
Semiconductor module |
6710441, |
Jul 13 2000 |
Infineon Technologies Austria AG |
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE PACKAGING METHODS, AND METHODS OF FORMING A POWER TRANSISTOR |
6891223, |
Mar 19 2002 |
Infineon Technologies AG |
Transistor configuration with a structure for making electrical contact with electrodes of a trench transistor cell |
6969909, |
Dec 20 2002 |
Picor Corporation |
Flip chip FET device |
7038917, |
Dec 27 2002 |
Vicor Corporation |
Low loss, high density array interconnection |
7166898, |
Aug 12 2005 |
Picor Corporation |
Flip chip FET device |
8021918, |
Sep 29 2006 |
Qualcomm Incorporated |
Integrated circuit chips with fine-line metal and over-passivation metal |
20040004272, |
|
|
|
20100096756, |
|
|
|
20120299069, |
|
|
|
D259559, |
Jul 28 1978 |
Hitachi, LTD |
Semiconductor |
D328599, |
Apr 10 1990 |
Gemplus Card International |
Connecting terminal for chip cards |
D396846, |
Apr 16 1997 |
Panasonic Corporation |
Semiconductor device |
D396847, |
Oct 17 1996 |
Panasonic Corporation |
Semiconductor device |
D444132, |
Aug 23 2000 |
Kabushiki Kaisha Toshiba |
Semiconductor element |
D456367, |
Dec 15 2000 |
Protek Devices, LP |
Semiconductor chip |
D466093, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD |
Hybird integrated circuit board |
D473199, |
Nov 30 2001 |
Kabushiki Kaisha Toshiba |
Portion of semiconductor device |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D476962, |
Mar 29 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D480371, |
Nov 30 2001 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D489338, |
Jul 28 2003 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Packaged semiconductor device |
D504874, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D510728, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
D701843, |
Dec 28 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
D721047, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
D732487, |
Aug 06 2013 |
EPISTAR CORPORATION |
Partial semiconductor light emitting component |
D732488, |
Aug 06 2013 |
EPISTAR CORPORATION |
Partial semiconductor light emitting component |
RE44372, |
Apr 15 2008 |
Vicor Corporation |
System and apparatus for efficient heat removal from heat-generating electronic modules |