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Patent
   D732487
Priority
Aug 06 2013
Filed
Jan 21 2014
Issued
Jun 23 2015
Expiry
Jun 23 2029
Inventors
Pan, Shyi-…
Assg.orig
Formosa Ep…
Assg.curr
EPISTAR CO…
Entity
unknown
Referenced by
11
References
31
Maint.:
n/a
The ornamental design for a partial semiconductor light emitting component, as shown and described.

FIG. 1 is a perspective view of a partial semiconductor light emitting component showing our new design; and,

FIG. 2 is a top plan view thereof.

A bottom plan view, a front elevation view, a rear elevation view, a right side view, and a left side view of a partial semiconductor light emitting component form no part of the claimed design.

The broken lines shown in the drawings represent unclaimed portions of the partial semiconductor light emitting component and form no part of the claimed design.

The dash-dot-dash lines represent a boundary between the clamed design subject matter and the unclaimed design subject matter.
INVENTORS:

Pan, Shyi-Ming, Li, Jen-Chih, Lai, Lung-Kuan, Cheng, Wei-Kang

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
10267506, Nov 22 2010 CREELED, INC Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
9786825, Feb 07 2012 CREELED, INC Ceramic-based light emitting diode (LED) devices, components, and methods
9806246, Feb 07 2012 CREELED, INC Ceramic-based light emitting diode (LED) devices, components, and methods
9826581, Dec 05 2014 CREELED, INC Voltage configurable solid state lighting apparatuses, systems, and related methods
D752000, Mar 07 2013 Vicor Corporation Semiconductor device
D820817, Mar 06 2017 FITIVISION TECHNOLOGY INC. Antenna used in wireless communication
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D904355, Dec 11 2015 TELIT CINTERION DEUTSCHLAND GMBH Radio module
D905647, Jul 20 2018 HEATSCAPE COM, INC Combination heat pipe and heat sink
D935424, May 06 2019 Lam Research Corporation Semiconductor wafer processing tool
D967818, Sep 17 2019 Samsung Display Co., Ltd. Display panel
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ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 13 2014LAI, LUNG-KUANFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0320140206 pdf
Jan 13 2014LI, JEN-CHIHFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0320140206 pdf
Jan 13 2014CHENG, WEI-KANGFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0320140206 pdf
Jan 13 2014PAN, SHYI-MINGFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0320140206 pdf
Jan 21 2014Formosa Epitaxy Incorporation(assignment on the face of the patent)
Sep 22 2016Formosa Epitaxy IncorporationEPISTAR CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0401490765 pdf
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