Patent
   D473199
Priority
Nov 30 2001
Filed
May 29 2002
Issued
Apr 15 2003
Expiry
Apr 15 2017
Assg.orig
Entity
unknown
16
11
n/a
The ornamental design for a portion of semiconductor device, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a portion of semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,

FIG. 5 is a rear elevational view thereof.

The broken line portions are shown for illustrative purpose only and form no part of the claimed design.

Ide, Takahiro, Sako, Shigeki, Fukuda, Kazuyoshi, Ootomo, Masahiro

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 29 2002Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Jun 20 2002SAKO, SHIGEKIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132170077 pdf
Jun 20 2002IDE, TAKAHIROKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132170077 pdf
Jun 24 2002OOTOMO, MASAHIROKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132170077 pdf
Jun 24 2002FUKUDA, KAZUYOSHIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0132170077 pdf
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