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The ornamental design for a portion of semiconductor device, as shown and described.
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FIG. 1 is a front, bottom and right side perspective view of a portion of semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.
The broken line portions are shown for illustrative purpose only and form no part of the claimed design.
Ide, Takahiro, Sako, Shigeki, Fukuda, Kazuyoshi, Ootomo, Masahiro
Patent | Priority | Assignee | Title |
8975694, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
9269661, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
D480371, | Nov 30 2001 | Kabushiki Kaisha Toshiba | Semiconductor device |
D720310, | Jun 17 2011 | KORRUS, INC | Triangular semiconductor die |
D721047, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D732487, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D732488, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D752000, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D758329, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D763806, | Dec 12 2012 | KORRUS, INC | Triangular semiconductor die |
D852765, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D853343, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D856947, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D859334, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D864135, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D877739, | Sep 15 2017 | uQontrol, Inc. | Smartcard with Q-shaped contact pad |
Patent | Priority | Assignee | Title |
5105257, | Aug 08 1990 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
5309018, | Apr 28 1992 | Rohm Co., Ltd. | Lead frame having deformable supports |
5585670, | Sep 05 1995 | Mitsubishi Electric Semiconductor Software Co.; Mitsubishi Denki Kabushiki Kaisha | Semiconductor device package |
5925927, | Dec 18 1996 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
6020625, | Mar 27 1998 | Renesas Electronics Corporation | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
6093957, | Apr 18 1997 | LG Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
6177718, | Apr 28 1998 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
D259559, | Jul 28 1978 | Hitachi, LTD | Semiconductor |
D416872, | Nov 06 1997 | ZF MICRO SOLUTIONS, INC | Single component computer |
JP1079850, | |||
JP800572, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 29 2002 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / | |||
Jun 20 2002 | SAKO, SHIGEKI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013217 | /0077 | |
Jun 20 2002 | IDE, TAKAHIRO | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013217 | /0077 | |
Jun 24 2002 | OOTOMO, MASAHIRO | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013217 | /0077 | |
Jun 24 2002 | FUKUDA, KAZUYOSHI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013217 | /0077 |
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