Patent
   D758329
Priority
Aug 06 2013
Filed
Jan 17 2014
Issued
Jun 07 2016
Expiry
Jun 07 2030

TERM.DISCL.
Assg.orig
Entity
unknown
3
31
n/a
The ornamental design for a partial semiconductor light emitting component, as shown and described.

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawings will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a perspective view of a partial semiconductor light emitting component showing our new design; and,

FIG. 2 is a top plan view thereof.

The broken lines shown in the drawings represent unclaimed portions of the partial semiconductor light emitting component and form no part of the claimed design. A bottom plan view, a front elevation view, a rear elevation view, a right side view, and a left side view thereof form no other part of the claimed design.

The new design is the appearance of a partial semiconductor light emitting component, wherein the partial semiconductor light emitting component has a black pattern separated in two areas in a surface of the partial semiconductor light emitting component.

Pan, Shyi-Ming, Li, Jen-Chih, Lai, Lung-Kuan, Cheng, Wei-Kang

Patent Priority Assignee Title
D795217, Sep 07 2012 Apple Inc. Component for an electronic device
D935424, May 06 2019 Lam Research Corporation Semiconductor wafer processing tool
D967818, Sep 17 2019 Samsung Display Co., Ltd. Display panel
Patent Priority Assignee Title
4127792, Jun 01 1976 Mitsubishi Denki Kabushiki Kaisha Luminescent semiconductor display device including gate control electrodes
20010019245,
20050168143,
20080303408,
20090267526,
20110095701,
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D466873, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D472528, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D473199, Nov 30 2001 Kabushiki Kaisha Toshiba Portion of semiconductor device
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D476962, Mar 29 2002 Kabushiki Kaisha Toshiba Semiconductor device
D480371, Nov 30 2001 Kabushiki Kaisha Toshiba Semiconductor device
D489338, Jul 28 2003 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Packaged semiconductor device
D499384, Dec 28 2001 Nichia Corporation Light emitting diode
D504874, Aug 11 2004 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Semiconductor device package
D508682, Feb 23 2004 Kabushiki Kaisha Toshiba Semiconductor device
D510728, Aug 11 2004 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Semiconductor device package
D638810, May 14 2010 Panasonic Corporation Substrate for light source of light emitting diode
D642996, Apr 09 2010 PANASONIC ELECTRIC WORKS CO , LTD Electroluminescence apparatus
D664506, Feb 04 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D664508, Feb 04 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D684124, Sep 07 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D684125, Aug 30 2011 Panasonic Corporation Electroluminescence module
D684126, Aug 30 2011 Panasonic Corporation Electroluminescence module assembly
D687394, Feb 04 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D690277, Sep 07 2011 SAMSUNG DISPLAY CO , LTD Electroluminescence module
D701843, Dec 28 2010 Sumitomo Electric Industries, Ltd. Semiconductor device
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 13 2014LAI, LUNG-KUANFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0319930431 pdf
Jan 13 2014LI, JEN-CHIHFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0319930431 pdf
Jan 13 2014CHENG, WEI-KANGFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0319930431 pdf
Jan 13 2014PAN, SHYI-MINGFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0319930431 pdf
Jan 17 2014Formosa Epitaxy Incorporation(assignment on the face of the patent)
Sep 22 2016Formosa Epitaxy IncorporationEPISTAR CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0401490765 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule