Patent
   D935424
Priority
May 06 2019
Filed
May 06 2019
Issued
Nov 09 2021
Expiry
Nov 09 2036
Assg.orig
Entity
unknown
3
24
n/a
The ornamental design for a semiconductor wafer processing tool, as shown and described.

FIG. 1 is a perspective view of a semiconductor wafer processing tool, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Juco, Eller Y.

Patent Priority Assignee Title
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ER24,
ER3322,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 06 2019Lam Research Corporation(assignment on the face of the patent)
May 06 2019JUCO, ELLER Y Lam Research CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0490940405 pdf
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