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The ornamental design for a semiconductor wafer support, as shown and described. |
FIG. 1 is a front and upper right perspective view of a semiconductor wafer support showing our new design;
FIG. 2 is a front and lower left perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a left side elevational view thereof, the right side elevational view and the rear elevational view being the same;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a top plan view of a second embodiment of a semiconductor wafer support, all other views being the same as the first embodiment except for the four apertures seen on the top and bottom.
Pellet, Carrie, Donaldson, Craig
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 17 1992 | PELLET, CARRIE | PARTICLE SOLUTIONS, A CORP OF NORTH CAROLINA | ASSIGNMENT OF ASSIGNORS INTEREST | 006256 | /0904 | |
Aug 17 1992 | DONALDSON, CRAIG | PARTICLE SOLUTIONS, A CORP OF NORTH CAROLINA | ASSIGNMENT OF ASSIGNORS INTEREST | 006256 | /0904 | |
Aug 25 1992 | Particle Solutions | (assignment on the face of the patent) | / |
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