Patent
   D350942
Priority
Aug 25 1992
Filed
Aug 25 1992
Issued
Sep 27 1994
Expiry
Sep 27 2008
Assg.orig
Entity
unknown
4
13
n/a
The ornamental design for a semiconductor wafer support, as shown and described.

FIG. 1 is a front and upper right perspective view of a semiconductor wafer support showing our new design;

FIG. 2 is a front and lower left perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a left side elevational view thereof, the right side elevational view and the rear elevational view being the same;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a top plan view of a second embodiment of a semiconductor wafer support, all other views being the same as the first embodiment except for the four apertures seen on the top and bottom.

Pellet, Carrie, Donaldson, Craig

Patent Priority Assignee Title
D443253, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Transistor substrate
D650344, Oct 20 2008 Ebara Corporation Vacuum contact pad
D700502, Nov 28 2011 Mobile device mount clip assembly
D935424, May 06 2019 Lam Research Corporation Semiconductor wafer processing tool
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 17 1992PELLET, CARRIEPARTICLE SOLUTIONS, A CORP OF NORTH CAROLINAASSIGNMENT OF ASSIGNORS INTEREST 0062560904 pdf
Aug 17 1992DONALDSON, CRAIGPARTICLE SOLUTIONS, A CORP OF NORTH CAROLINAASSIGNMENT OF ASSIGNORS INTEREST 0062560904 pdf
Aug 25 1992Particle Solutions(assignment on the face of the patent)
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