Patent
   D260237
Priority
Aug 07 1978
Filed
Aug 07 1978
Issued
Aug 18 1981
Expiry
Aug 18 1995
Assg.orig
Entity
unknown
23
6
n/a
The ornamental design for a semiconductor wafer container, as shown and described.

FIG. 1 is a perspective view of a semiconductor wafer container showing my new design,

FIG. 2 is a side elevational view thereof, with the top in exploded relation,

FIG. 3 is an end elevational view thereof, with the top in exploded relation,

FIG. 4 is a top plan view thereof, and

FIG. 5 is a bottom plan view thereof.

Fuzere, Robert J.

Patent Priority Assignee Title
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5816410, Jul 15 1994 Entegris, Inc Wafer cushions for wafer shipper
6145663, Oct 22 1997 LG DISPLAY CO , LTD Apparatus for packing liquid crystal display modules
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6344091, Feb 04 1998 Micron Technology, Inc. Methods of processing semiconductor wafers, methods of supporting a plurality of semiconductor wafers, methods of processing electronic device workpieces and methods of orienting electronic device workpieces
6427850, Feb 04 1998 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Electronic device workpiece carriers
6889838, Aug 03 2000 Atlas Copco Electric Tools GmbH Tool Box
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D344891, Feb 03 1992 Empak, Inc. Disc package for semiconductor wafers
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D358761, Sep 16 1993 STD Electronic International Ltd. Container for cartridge
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D396804, Jun 23 1997 Inline Plastics Corporation Product holding and displaying container
D398227, Jun 23 1997 Inline Plastics Corporation Product holding and displaying container
D398525, Jun 23 1997 Inline Plastics Corporation Product holding and displaying container
D515438, Sep 03 2004 S C JOHNSON & SON, INC Container
D935424, May 06 2019 Lam Research Corporation Semiconductor wafer processing tool
Patent Priority Assignee Title
3987829, May 05 1975 Container with lid
4043451, Mar 18 1976 EMPAK, INC Shipping container for silicone semiconductor wafers
4160504, Jan 21 1977 WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN MBH Packaging unit for semiconductor discs
CA468993,
192621,
PK110754,
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Aug 07 1978Fuzere Manufacturing Co., Inc.(assignment on the face of the patent)
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