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The ornamental design for a wafer holding frame, as shown. |
FIG. 1 is a front elevational view of a wafer holding frame showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side elevational view thereof; and
FIG. 6 is a cross sectional view thereof taken along line A--A in FIG. 1.
Nakane, Hisashi, Uehara, Akira, Hijikata, Isamu, Nakayama, Muneo
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 11 1984 | UEHARA, AKIRA | TOKYO DESHI KAGAKU CO | ASSIGNMENT OF ASSIGNORS INTEREST | 004356 | /0101 | |
Dec 11 1984 | NAKANE, HISASHI | TOKYO DESHI KAGAKU CO | ASSIGNMENT OF ASSIGNORS INTEREST | 004356 | /0101 | |
Dec 14 1984 | HIJIKATA, ISAMU | TOKYO DESHI KAGAKU CO | ASSIGNMENT OF ASSIGNORS INTEREST | 004356 | /0101 | |
Dec 19 1984 | NAKAYAMA, MUNEO | TOKYO DESHI KAGAKU CO | ASSIGNMENT OF ASSIGNORS INTEREST | 004356 | /0101 | |
Jan 08 1985 | Tokyo Denshi Kagaku Co., Ltd. | (assignment on the face of the patent) | / |
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