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I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described. |
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FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof.
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2.
FIG. 5 a rear elevational view thereof.
FIG. 6 a right side view thereof.
FIG. 7 a top plan view thereof; and,
FIG. 8 a bottom plan view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 05 1998 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
| Mar 18 1998 | SHIMAZU, TOMOHISA | TOKYO ELECTRON LLIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009128 | /0164 |
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