Patent
   D908102
Priority
Feb 20 2019
Filed
Feb 20 2019
Issued
Jan 19 2021
Expiry
Jan 19 2036
Assg.orig
Entity
unknown
1
42
n/a
The ornamental design for a transportable semiconductor wafer rack, as shown and described.

FIG. 1 is a perspective view of a transportable semiconductor wafer rack showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a first side view thereof;

FIG. 5 is a second side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a cross-section view taken along line 8-8 of FIG. 7; and,

FIG. 9. is another cross-section view taken along line 9-9 of FIG. 7.

The broken lines in the Figures are for the purpose of illustrating unclaimed portions of the transportable semiconductor wafer rack and form no part of the claimed design. The shade lines in the Figures show contour and not surface ornamentation.

Lecordier, Laurent, Sershen, Michael J., Pacier, Michael W., Bertuch, Adam F.

Patent Priority Assignee Title
11929272, Jul 31 2019 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 20 2019Veeco Instruments Inc.(assignment on the face of the patent)
Feb 22 2019PACIER, MICHAEL WVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0485060455 pdf
Feb 22 2019SERSHEN, MICHAEL J Veeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0485060455 pdf
Feb 27 2019BERTUCH, ADAM FVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0485060455 pdf
Feb 28 2019LECORDIER, LAURENTVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0485060455 pdf
Dec 16 2021Veeco Instruments INCHSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENTPATENT SECURITY AGREEMENT0585330321 pdf
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